Ansys Structures

It's here! Ansys Mechanical 2024 R2 is now available for download. Watch the video below to see a few of our top new features and capabilities, including: 1) NVH Workflow: Integrated Tools for Noise, Vibration, and Harshness Analysis 2) Enhanced Pretest Calculator: Efficient Sensor Placement 3) Energy and Mode Contributions: Detailed Response Analysis 4) New Fluid Penetration Pressure Loading: Accurate Sealing Simulations 5) Body Merge Feature: Simplify Complex Geometries 6) Iterative Solver Settings: Boost Performance for Large Models 7) Enhanced Resource Prediction: Customizable Core Usage Click here to see the whole video: https://ansys.me/3WybBtv Don't miss out on the latest enhancements that will take your simulations to the next level. Head over to your Ansys portal and download the 2024 R2 release now!

Cardiac Modelling in LS-DYNA requires Multiphysics coupling electrophysiology, mechanical and fluid dynamics. Using Ansys LS-DYNA, electrophysiology (EP) models enable the automatic generation of the Purkinje network which can be coupled to mono/bi domain models. With the creation and connection of Purkinje nodes and Myocardial nodes, alongside pseudo-ECG computation – this helps in the prediction of drug effects on ECGs.

Did you know that #Ansys Sherlock + Ansys Mechanical can be used to model and simulate Flexible and Rigid-Flex PCBs? Users can simulate complex installation steps, operational conditions, and better understand the influence of key input parameters (such as bend radius) on the reliability of their boards.

Did you know Ansys Mechanical has a meshing enhancement, called feature suppress, that can remove embossed and indented features on a model which can cause quality and robustness issues? The defeaturing occurs at the mesh level, so users don't have to go back and make edits to the underlying geometry. Check out this feature in action in the images below, where the logo was automatically suppressed.

The animation below unveils the stresses encountered by a Ball-Grid Array (BGA) during a drop-test, spotlighting LS-DYNA’s multi-scale simulation prowess. As solder joints are often the first to fail in drop-tests, accurately predicting their behavior is paramount. LS-DYNA transcends traditional simulation barriers with multi-scale simulation, offering a nuanced view into both macro and meso-scale geometric details, thus significantly enhancing the reliability analysis in drop-tests. The synchronized two-scale co-simulation technique allows for a seamless, concurrent analysis, making the prediction of solder joint failures more accurate and efficient. Uncover how this breakthrough accelerates the pace towards robust electronics design.

The shaving of metal is simulated by Smoothed Particle Galerkin method (SPG). SPG is a genuine meshfree method based on Galerkin weak formulation. SPG can keep the conservation of mass and momentum during material failure by its novel bond-based failure mechanism. In the animation, a thin piece of material is cut from specimen. The effective plastic strain is confined nearby the new surface. The thin shaved material piece breaks into chips along shear bands. It illustrates that SPG can capture ductile material deconstructing and the post failure material response in small debris. #lsdyna #ansys

Ansys Mechanical has powerful multiphysics capabilities through the Coupled Field elements. A variety of physical degrees of freedom including thermal, acoustic, electric, structural can be coupled to solve highly challenging problems. This animation shows an analysis using structural, piezoelectric, and acoustic coupling. A wave is created by a piezoelectric sensor, that then passes through either structural or acoustic media to evaluate the integrity of that media (pipeline, well casing, etc.).

In general, forming processes are composed of several mutual depending process steps, such as pre-forming, trimming and the final forming. Each step changes the stuctural properties, via, e. g., damage, sheet-metal thining and material hardening. Thus, at best, a holistic simulations needs to account for all the individual steps, thereby, transfering the resulting properties from one stage to another in a single simulation model. Ansys Forming helps you to set up complex multi-stage simulation models for LS-DYNA and tp analyse the simulation results.

Ansys Sherlock can quickly generate high-fidelity models of Chip, Die, and Package-Level components! Users can leverage leading technologies such as Trace Modeling, Trace Mapping, and Trace Reinforcements to model trace and via details. The models can then be exported to Ansys Mechanical to evaluate failure modes such as Trace Cracking, Delamination, and many others.

Ansys Mechanical offers several methods to simulate crack propagation: 1) SMART Crack Growth: SMART stands for Separating, Morphing, Adaptive, and Remeshing Technology. This method automates the remeshing process around the crack front during the solution, enabling efficient simulation of both static and fatigue crack growth. SMART is particularly effective for Mode I dominant crack growth scenarios. 2) Crack Initiation and Propagation using SMART Crack Growth: This feature allows users to define criteria for crack initiation in specific regions of the geometry. Once initiated, the crack's growth can be studied using the SMART Crack Growth method. 3) Extended Finite Element Method (XFEM): XFEM extends the classical finite element method by enriching the solution space to handle discontinuities like cracks. It enables the modeling of crack growth without the need for remeshing, making it suitable for complex crack propagation scenarios. These tools in Ansys Mechanical provide engineers with robust capabilities to analyze and predict crack behavior, aiding in the design of safer and more reliable structures. #Ansys #engineering #innovation