Intelligent surfaces are envisioned to enable a wide range of applications for future 6G scenarios.?This comprehensive survey explores their recent development and advances. https://bit.ly/3CV8nsF Qingqing Wu et al., "Intelligent Surfaces Empowered Wireless Network: Recent Advances and the Road to 6G," in?Proceedings of the IEEE, vol. 112, no. 7, pp. 724-763, July 2024 #Intelligentsurfaces #6G #wirelessnetworks
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For over 100 years, Proceedings of the IEEE has been the leading journal for engineers looking for in-depth tutorial, survey, and review coverage of the technical developments that shape our world.
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https://proceedingsoftheieee.ieee.org
Proceedings of the IEEE的外部链接
- 所属行业
- 图书期刊出版业
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- Piscataway，NJ
- 创立
- 1913
动态
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Ultradense cell-free massive #MIMO is a promising technology poised to meet the future demands of ubiquitous connectivity and surging data traffic in #6G. Learn more about this technology and the key questions surrounding its future deployment: https://bit.ly/40UboUh Ngo Quoc Hien, Giovanni Interdonato, Erik G. Larsson, Giuseppe Caire and Jeff Andrews, "Ultradense Cell-Free Massive MIMO for 6G: Technical Overview and Open Questions," in?Proceedings of the IEEE, vol. 112, no. 7, pp. 805-831, July 2024
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Emerging additive manufacturing technologies are reshaping the design capabilities and functionalities of contemporary electronic devices. This article presents a comprehensive review of the emerging 3D/4D printing and origami techniques using multimaterials and shape-memory materials for designing functional electronic components and devices. https://bit.ly/3V5ZxyO Yang Yang, Zhiwei Yin, Xuyi Zhu, Hani Al Jamal, Xiaojing Alex Lv, Kexin Hu, Marvin Joshi, Nathan Wille, Mengze Li, Bing Zhang, Zhen (Jeff) Luo, Shlomo Magdassi, and Manos Tentzeris, "A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation," in?Proceedings of the IEEE, vol. 112, no. 8, pp. 954-999, Aug. 2024 #3DPrinting #4DPrinting #AddiviteManufacturing
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How do #AI / #MachineLearning synergistically interact with #WirelessCommunications to improve system performance? Learn about practical tips for realizing these performance gains while training AI/ML models in this article: https://bit.ly/3CtQr8x Zhijin Qin, Le Liang, Zijing Wang, Shi Jin, Xiaoming Tao, Wen Tong, and Geoffrey Ye Li, "AI Empowered Wireless Communications: From Bits to Semantics," in?Proceedings of the IEEE, vol. 112, no. 7, pp. 621-652, July 2024.
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We are excited to announce the recipient of our 2024 Best Paper Award: "Training Spiking Neural Networks Using Lessons From Deep Learning" in Proceedings of the IEEE, vol. 111, no. 9, pp. 1016-1054, Sept. 2023 Congratulations to the authors: Jason Eshraghian, Max Ward, Emre Neftci, Xinxin Wang, Gregor Lenz, Girish Dwivedi, Mohammed Bennamoun, Doo Seok Jeong, and Wei Lu! Drawing insights from deep learning, circuit design, neuromorphic engineering, and medical AI, this tutorial offers an interdisciplinary perspective on how to apply modern deep learning principles to train networks of spiking neurons. Read this paper at https://bit.ly/48w1B8g
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Our new special section covers state-of-the-art multimaterial 3-D printing electronics, emerging 4-D printing concept, and guideline for 4-D electronic component designs. https://bit.ly/3Avc8ED #3DPrinting #4DPrinting
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With the realization of 6G only a few years away, this timely special issue, The Road to 6G: Driving the Next Wave of Connectivity, explores the forefront of communication technology and its applications in environments with distinct challenges. Read more at https://bit.ly/4fkFQLP. Guest Editors: Mohamed-Slim Alouini (KAUST (King Abdullah University of Science and Technology)) Emil Bj?rnson, (KTH Royal Institute of Technology) Meixia Tao (Shanghai Jiao Tong University) Yasamin Mostofi (UC Santa Barbara) #6G #wirelesscommunications
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Join our webinar on November 13, at 9AM ET, to learn about the scientific and engineering challenges of the multimaterial 3-D and 4-D printing techniques, potential solutions to these challenges, and the future prospects in industrial electronics beyond 5G, 6G, space, and IoT.?bit.ly/40nLMiv Our panelists will discuss recent advancement in multimaterial additive manufacturing and its applications in electronic components, from laboratory concepts to industrial products. The session will also cover the emerging field of 4D printing electronics and their potential applications in electronic?engineering. Panelists: Manos Tentzeris (Georgia Institute of Technology) Chi-Hou Chan (City University of Hong Kong) Sungjoon Lim (Chung-Ang University) Yang Yang (University of Technology Sydney) Valentina Palazzi (Università degli Studi di Perugia) Register Today: bit.ly/40nLMiv #3DPrinting #AdditiveManufacturing
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The saltation matrix is an essential tool that updates system sensitivity when a "jump" occurs in hybrid dynamical systems. This article presents a derivation of the saltation matrix and demonstrates how it can be used in linear and quadratic forms for hybrid systems. https://bit.ly/3UdxuNr Nathan Kong , Joe Payne, James Zhu, and Aaron Johnson, "Saltation Matrices: The Essential Tool for Linearizing Hybrid Dynamical Systems," in?Proceedings of the IEEE, vol. 112, no. 6, pp. 585-608, June 2024
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The main challenge in full-duplex networks is internode interference. This article addresses key aspects of full-duplex network design to manage interference—medium access control protocol, user scheduling, and cross-link interference handling. bit.ly/3Nodgg6 Yonghwi Kim, Hyung-Joo Moon, Hanju Yoo, Klaus(Byoungnam) Kim, Kai-Kit Wong and Chan-Byoung Chae, "A State-of-the-Art Survey on Full-Duplex Network Design," in?Proceedings of the IEEE, vol. 112, no. 5, pp. 463-486, May 2024 #FullDuplex #MediumAccessControl #PhysicalLayer
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