关于我们
Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, and via-in-pad technology. Use our HDI Stackup Planner or Material Selector.
- 网站
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https://www.protoexpress.com/hdi/
High Density Interconnect的外部链接
- 所属行业
- 半导体制造业