High Density Interconnect

High Density Interconnect

半导体制造业

关于我们

Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, and via-in-pad technology. Use our HDI Stackup Planner or Material Selector.

网站
https://www.protoexpress.com/hdi/
所属行业
半导体制造业

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