DuPont Interconnect Solutions

As #AI systems become faster and more powerful, they need materials solutions that ensure performance and reliability. DuPont’s powerhouse portfolios for advanced interconnects and thermal management work across the chip package and #PCB to support the complex performance demands of AI. Visit our content hub to learn more: https://lnkd.in/gSVUr55f?

Join us for Insulectro PowerChats during the IPC Apex Expo. Our team of experts will be at booth #4138, sharing everything from the latest advancements in panel plate via filling to high-performance solutions for multi-layer rigid boards. Check out the full schedule of these quick and educational sessions below!

Connectors play a vital role in electronic systems. Plated finishes must meet increasingly challenging requirements and environmental conditions, as data rates increase and as high voltage connectors proliferate in e-mobility applications. Visit us at Connector Symposium in Germany on March 19 and 20 to meet our team and learn more about our connector offerings. DuPont provides comprehensive process solutions for connector finishing, designed for a variety of applications—from high data rate board-to-board connectors to automotive and datacom press-fit connectors. These solutions enhance corrosion resistance, deliver on durability requirements, and improve contact performance. Learn more: https://lnkd.in/g7Haufqy

We are thrilled our Pyralux? ML laminates have won the New Product Introduction (NPI) Award in the Laminates category. The NPI Award, presented by Circuits Assembly, a publication run by PCEA-Printed Circuit Engineering Association, recognizes the most innovative and leading new products within the electronics assembly industry, including equipment, materials, and software, as judged by an independent panel of practicing industry engineers. Congratulations to our team for their dedication and efforts to develop this innovative technology, focused on optimizing thermal management in high-performance applications. Read more about the award here: https://lnkd.in/gPhWANvt View the video celebrating the winners here: https://lnkd.in/gR4X9CJ8 #PCEA #CircuitsAssembly #NPIAward

AI applications are advancing rapidly, driving the need for more sophisticated packaging and materials solutions. As designs become denser and more complex, engineers face new challenges in performance, reliability, and manufacturability. The right material choices play a critical role in ensuring stable signal integrity, efficient thermal management, and seamless high-frequency performance. Watch our expert discussion to learn how materials innovations are shaping the future of #AI.

How are laminates products supporting innovations in #AI? Hear from Eric Lin, APEC sales & global commercial excellence leader for DuPont Advanced Flex Technologies, how products such as Pyralux? and Interra? are enabling AI systems and more.

Sao-Hsia Tang, circuit metallization and product management leader for DuPont Advanced Circuit & Packaging, is sharing some of our latest innovations at Intelligent Asia Thailand. Watch our video below to learn about new solutions that are driving the next generation of PCBs for network communications, automotive, consumer electronics industries and more. #PCBDesign #Manufacturing

As the automotive industry transitions toward electrification and automation, and the datacom industry expands 5G infrastructure and server technologies, the need for both sectors advanced multilayer boards (MBL) and high-density interconnects (HDI) with high reliability interconnect becomes paramount. DuPont offers state-of-the-art materials for flexible, rigid-flex, and rigid PCBs, enabling the seamless integration of complex circuits. Our innovative solutions encompass both high-performance chemistry that addresses fine pitch and advanced reliability requirements, as well as comprehensive signal integrity offerings designed for high-frequency and high-speed data transfer applications. These products effectively tackle industry challenges, ensuring optimal performance, efficient power transmission, and reliable signal integrity. Learn more about our portfolio of advanced interconnect solutions at Intelligent Asia:?https://lnkd.in/eMrBmqr9

See our comprehensive range of signal integrity and power and thermal management solutions driving the next generation of electronics at IPC Apex Expo 2025. From Copper Gleam? pulse electroplating for advanced multi-layer boards to Pyralux? flex circuit laminates & adhesives that enable enhanced signal integrity, to Kapton? polyimide films protecting the James Webb Space Telescope from extreme heat, DuPont Interconnect Solutions’ materials enable high-performance and reliability across a variety of applications. Access a free Event Essentials Pass and visit us at the expo to see our newest innovations and discuss trends in high-performance electronic design: https://lnkd.in/gCCG6G3w

The next generation of electronic vehicles will require innovations in battery management to support increased safety, longer range and charging efficiency, sustainability and more. Advanced packaging trends, new technologies, and novel, performance-enhancing materials are critical to #EV battery innovation. Read in Electronic Design magazine the latest trends in battery packaging architectures and how DuPont is solving #EMI, #ThermalManagement and range-anxiety challenges: https://lnkd.in/gVNNfAH7