Design with Calibre

Were you at SPIE last month? Or not able to make it but wonder what you missed? We've got you covered with our wrap up of the week! https://lnkd.in/gHmGiEP3

Flexible, foundry-independent layout optimization is key for modern IC design. See how Calibre DesignEnhancer integrates seamlessly into existing design environments to boost performance and time-to-market. https://lnkd.in/gGpf5fk2

Chemical stochastic effects impact resist films right after exposure—whether from electrons in e-beam mask writing or EUV photons in EUVL. Azat Latypov was at #spielitho last week explaining how Siemens EDA (Siemens Digital Industries Software) has expanded compact #Calibre stochastic models to account for this variability, e.g. for identification of “hot spots” in e-beam mask writing where stochastic variability spikes, improving precision in advanced lithography. If you weren't at SPIE, or want a reminder of what was there - watch for our wrap up blog coming soon covering our week!

Optimizing OPC models is tough—manual term selection is slow and tedious. Jongyoon Bae was at #spielitho last week to share how Siemens EDA (Siemens Digital Industries Software) is eliminating that challenge with a machine learning (ML)-driven approach using #Calibre SONR. By leveraging high-performance supervised clustering, we systematically reduce dimensionality, removing irrelevant and duplicate terms. Our method selects only the most meaningful kernels from a vast library, improving accuracy while cutting effort. Benchmarking against our best-known manual model shows the power of ML in OPC modeling. If you weren't able to attend SPIE don't worry! Watch for our wrap up blog coming soon covering our week there!

Skeleton extraction is crucial in semiconductor manufacturing, especially for Optical Proximity Correction (OPC) and mask correction. Traditional algorithms struggle with accuracy and connectivity, often leading to distorted results. Loay Anwar is at #spielitho discussing how our enhanced algorithm, designed for #EDA improves precision by reducing noise and ensuring continuous skeletons. This advancement boosts pattern fidelity, efficiency, and overall yield in photomask optimization. A step forward in refining semiconductor design! Watch for our wrap up blog coming soon highlighting our week at SPIE.

Traditional Critical Dimension (CD) measurements face challenges with thresholding and misclassification, making data cleaning unreliable. As the industry shifts to contour-based modeling, a more comprehensive approach is needed. To address this issue, we are at #spielitho to discuss how Siemens EDA (Siemens Digital Industries Software) has developed a novel digital image processing method and an ML model to automate image classification. By evaluating entire images, our approach enhances fidelity assessment, data cleaning, and quality control. With greater accuracy & automation, #Calibre is making SEM image analysis more efficient and reliable—advancing lithography pattern fidelity. Not at SPIE? Watch for our wrap up blog coming soon covering our week here!

EUV lithography masks have long relied on periodic silicon-molybdenum multilayers, a design which has performed well at 0.33 NA and has been adapted to 0.55 NA. However, as features shrink, 3D mask effects like shadowing become more problematic. While absorber material innovations (attPSM, low-n, index-matched) have gained traction, William Ethan Maguire is at #spielitho to share a new approach with #Calibre: aperiodic multilayers. By individually optimizing the thickness of each layer, we can improve reflection, phase control, degree of polarization, and bandwidth. Using Siemens EDA (Siemens Digital Industries Software) pxSMO, we validate the potential of this next-gen mask design showing large gains in printability for even the smallest patterns. Could aperiodic structures be the future of EUV masks? If you aren't at SPIE this week don't worry - watch for our wrap up blog coming soon covering our week here!

Reliability issues caught late in the design cycle aren’t just frustrating—they’re costly and time-consuming. The challenge? Traditional verification methods often don’t flag these problems until it’s too late. Siemens' Insight Analyzer changes that by enabling engineers to identify potential failures much earlier—right at the pre-layout schematic stage. We've asked Matthew Hogan to go into more detail about this in our most recent newsletter now available

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Do you need early design analysis without simulation??Siemens' Insight Analyzer provides the reliability verification IC designers need. Detect problems early, optimize designs and deliver high-quality chips. Matthew Hogan dives into this topic in this week's blog https://lnkd.in/gzpRFNfM #EDATools #ICDesign