CHIPS for America

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry. The expected recipients are Absolics Inc. in Georgia, Applied Materials Inc. in California, and Arizona State University in Arizona. These competitively awarded research investments, each expected to total as much as $100 million, represent novel efforts in advanced substrates. Advanced substrates are physical platforms that allow multiple semiconductor chips to be assembled seamlessly together, enable high-bandwidth communication between those chips, efficiently deliver power, and dissipate unwanted heat. The advanced packaging enabled by advanced substrates translates to high performance computing for AI, next-generation wireless communication, and more efficient power electronics. Such substrates are not currently produced in the United States but are foundational to establishing and expanding domestic advanced packaging capability. Up to $300 million in federal funding will be paired with additional investments from the private sector, bringing the expected total investment across all three projects to over $470 million. This combined effort will help ensure U.S. manufacturers stay competitive and continue to drive technological innovation, giving companies a stronger edge in global competition. Read the full press release to learn more about NAPMP Awardee: https://lnkd.in/ezV-EXqX #AdvancedPackaging #Manufacturing #Semiconductors #Technology #Innovation #Arizona #Geogia #California #ArtificialIntelligence

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded GlobalFoundries (GF) up to $1.5 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award comes after the previously signed preliminary memorandum of terms, announced on February 19, 2024, and the completion of the Department’s due diligence. The award will bolster U.S. competitiveness in current-generation semiconductor production by supporting the company’s investment of approximately $13 billion over the next 10-plus years in its U.S manufacturing sites in New York and Vermont, which produce essential automotive, smart mobile, aerospace and defense, and communications semiconductor technologies. The Department will disburse the funds based on GF’s completion of project milestones. Read the full press release to learn more about GlobalFoundries: https://lnkd.in/emTfEkMP #Semiconductors #CHIPSAct #NewYork #Vermont #SupplyChain #Manufacturing #Automotive #Aerospace #Defense

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation (SRC) Manufacturing Consortium Corporation are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina. With combined funding totaling $1 billion, this investment will support the launch of the first-of-its-kind CHIPS Manufacturing USA institute. The new institute, known as SMART USA (Semiconductor Manufacturing and Advanced Research with Twins USA) will focus on efforts to develop, validate, and use digital twins to improve domestic semiconductor design, manufacturing, advanced packaging, assembly, and test processes. SMART USA will join an existing network of seventeen institutes designed to increase U.S. manufacturing competitiveness and promote a robust R&D infrastructure. SRC is an important part of North Carolina’s research ecosystem, including decades-long relationships with North Carolina’s universities. Read the full press release to learn more about SRC and SMART USA:? https://lnkd.in/ejKDVk8y #SemiconductorManufacturing #Durham #DigitalTwins #AdvancedPackaging #Semiconductors #ResearchAndDevelopment

The White House shared a statement from President Joe Biden on the CHIPS and Science Act Final Award for TSMC Arizona. “Two years ago, shortly after I signed the CHIPS & Science Act, I visited Arizona to announce a commitment by TSMC to invest in America, create American jobs, and shore up American supply chains. On that day, I spoke about how the United States invented semiconductors and used to manufacture nearly 40% of the world’s chips, but now makes closer to 10% of them and none of the most advanced chips. I came to office determined to change that, and we have since delivered on that promise, catalyzing nearly $450 billion in private investment in semiconductors, creating over 125,000 new construction and manufacturing jobs, and reshoring critical technologies to bolster our national and economic security.” – President Joe Biden Read the full White House statement: https://lnkd.in/etVzig4N #NationalSecurity #SemiconductorManufacturing #Investment #TSMCArizona #CHIPS #CHIPSAct

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation (TSMC Arizona), a subsidiary of Taiwan Semiconductor Manufacturing Company Limited (TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award comes after the previously signed preliminary memorandum of terms, announced on April 8, 2024, and the completion of the Department’s due diligence. The award will support the company’s planned investment of more than $65 billion in three greenfield leading-edge fabs in Phoenix, Arizona. The Department will disburse the funds based on TSMC Arizona’s completion of project milestones. Read the full press release: https://lnkd.in/ebdjfMzp Find more information about TSMC Arizona’s award: https://lnkd.in/e9kgSpcV #TSMC #CHIPSAct #SuppyChain #EconomicSecurity #Semiconductors #ArtificialIntelligence #Manufacturing #NationalSecurity #TSMCAZ

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the CHIPS and Science Act. The proposed investment would support the construction of a 40,000 square foot cleanroom space within an existing building to transform it into a facility for semiconductor manufacturing. This proposed CHIPS funding, together with funding from Akash, venture capital firms, and other private investors, would support a $121 million investment and enable the company to leverage its intellectual property and experience of developing semiconductor technologies that serve important end markets, such as communications and the defense industrial base, while also creating over 400 direct manufacturing and construction jobs. Read the full press release: https://lnkd.in/d5AmUSQF #CHIPSAct #Semiconductor #ArtificialIntelligence #Innovation #IntellectualProperty #Defense #Communications #Manufacturing

The NSTC is excited to announce that the Call for Proposals for the third R&D jumpstart project, PFAS Reduction and Innovation in Semiconductor Manufacturing (PRISM) program, is officially open! The goal of the PRISM program is to enhance the sustainability of semiconductor manufacturing by addressing the challenges posed by per- and polyfluoroalkyl substance (PFAS) usage. Eligible applicants include domestic for-profit organizations, non-profit organizations, and accredited higher education institutes. Total program award funding up to $35M with 8-15 awards anticipated. Click here to learn more and submit your proposal today! https://lnkd.in/eQZkCFFv

REGISTRATION CLOSING SOON: Registration for?the CARISSMA Notice of Funding Opportunity Proposers’ Day will be closing soon. The deadline for in-person registration is Monday, November 11th at 5:00 PM ET and the deadline for virtual registration is Thursday, November 14th at 5:00 PM ET. Register and learn more about Proposers’ Day: https://lnkd.in/eXgyDAq2 On Friday, November 15, 2024, the CHIPS R&D Office is hosting a one-day hybrid Proposers’ Day for the Notice of Funding Opportunity (NOFO) for the CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA). Join us to learn more about CARISSMA and explore teaming opportunities. Learn more about the CARISSMA NOFO: https://lnkd.in/eW27s3dx The Proposers’ Day is intended to familiarize potential applicants with the objectives and structure of the recently released CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Notice of Funding Opportunity (NOFO). This will be a hybrid event, composed of a morning plenary session, afternoon networking sessions, and a poster session enabling entities to share information, foster collaboration, and advance shared goals. In-person attendance is highly encouraged. In-person attendance is highly encouraged. #ArtificialIntelligence #Autonomous #FundingOpportunity #ChipsAct #Semiconductors

Today, the U.S. Department of Commerce and Natcast.org, the operator of the National Semiconductor Technology Center (NSTC), announced Sunnyvale, California as the expected location for the CHIPS for America Design and Collaboration Facility (DCF), an NSTC Facility. The DCF will play an important role in advancing semiconductor design research, workforce development, investment, and collaboration across the entire semiconductor value chain.? The expected facility will bring together NSTC members from across the ecosystem to address some of the most demanding challenges facing the microelectronics industry and the world today, including the need for a skilled workforce and access to secure, cloud-based services for NSTC members. Learn more about the CHIPS for America DCF: https://lnkd.in/gZJd3Zx6 Read the full press release: https://lnkd.in/gkjrAidV #Semicondutors #DesignResearch #Workforce #Hardware #Security #ArtificialIntelligene #5G #CHIPSAct

Today, the U.S. Department of Commerce and Natcast.org, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES’ Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it. This proposed facility will bring together NSTC members from across the ecosystem to accelerate semiconductor R&D and innovation by providing NSTC members access to technologies, capabilities, and critical resources. Learn more about the CHIPS for America EUV Accelerator: https://lnkd.in/e3UymDz2 Read the full press release: https://lnkd.in/eB2QMBUr #Innovation #EUV #ResearchAndDevelopment #Semiconductors #Techonology #Workforce