Wireless Connectivity Unleashed: The Impact of Bluetooth Technology
Bluetooth technology has become ubiquitous in today's electronic landscape, seamlessly connecting devices without the hassle of wires. It revolutionizes how we interact with our gadgets, enabling a wide range of applications from hands-free communication in vehicles to streaming high-quality audio between smartphones and headphones. Since its inception, Bluetooth has evolved significantly, continually enhancing its capabilities in terms of speed, range, and energy efficiency. This evolution has not only made it a standard feature in smartphones, tablets, and laptops but also facilitated the rise of smart home devices and IoT solutions that rely on its reliable and low-power connectivity.
SILICON LABS XG26?SETS NEW STANDARD IN MULTIPROTOCOL WIRELESS DEVICE PERFORMANCE
The new family consists of the multiprotocol MG26?SoC, the Bluetooth LE BG26?SoC, and the PG26?MCU. All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter, with double the Flash and RAM of other Silicon Labs multiprotocol devices.
"As users from consumer to industrial sectors extract more benefits from their IoT deployments, their requirements are steadily increasing," said Matt Johnson, CEO of Silicon Labs, Inc. "The new xG26?family is built for the future, empowering device manufacturers with the confidence that their current designs will meet tomorrow’s demands."
To help designers build devices capable of running advanced IoT applications, the xG26?family can be equipped with:
MG26?Multiprotocol SoC Designed to be Most Advanced SoC for Matter over Thread Silicon Labs is all-in on Matter, the rapidly deploying application layer that allows devices to be interoperable between the leading IoT networks and ecosystems. Silicon Labs is Matter's leading semiconductor code contributor and third-largest contributor. The experience gained from working on Matter gave Silicon Labs deep insight into what it takes to build a device capable of growing with the needs of the Matter standard as it adds support for new device types, security enhancements, and more. Most device types have already seen Matter's code requirements grow by 6% in the first 18?months since Matter 1.0?was released in October 2022.
Consumers who invest in building Matter-enabled Smart Homes don't want their new devices to become obsolete in a few years. Instead, they want confidence that the Matter device they purchased last year will work with the same devices and be as secure as the next Matter device they buy next year. That's Matter's interoperability and security promise, which is why Silicon Labs designed the MG26?to be the most advanced SoC for the Matter standard.
Building off the same platform as the award-winning MG24?Multiprotocol Wireless SoC, the MG26?doubles its predecessor's Flash and RAM capacity and can be configured with up to 3200?kB of Flash and 512?kB of RAM. It also has double the number of general-purpose input/output (GPIO) pins as the MG24, meaning that device builders can connect it to twice as many peripherals for better system integration.
To enable greater intelligence for not only Matter-enabled applications, but all applications, the MG26, BG26, and PG26?also use Silicon Labs' proprietary Matrix Vector AI/ML hardware accelerator. This dedicated core is optimized for machine learning and can process ML operations up to 8x faster using as little as 1/6th the energy as a traditional embedded CPU.
This significantly improves the family's energy efficiency because the device can offload ML-based activation or wake cues to the accelerator, allowing more power-hungry functions to sleep and minimize battery drain. This is ideal for smart home battery-operated devices like sensors or switches, where consumers look for them to fade into the background of their home and not draw their attention with the need for constant battery changes.
Silicon Labs Extends IoT Leadership with New SoC and MCU Family
Silicon Labs is one of the world’s leading pure-play IoT companies, and no other can match its breadth, depth, and expertise in the Internet of Things. That's why the xG26?launches as a family. While the MG26?is ideal for Matter, the BG26?Bluetooth SoC brings all the same features and is optimized for Bluetooth LE and Bluetooth Mesh, and the PG26?brings low-power intelligence to unconnected applications like CCTV cameras, remotes, and children's toys. Pin compatibility between select xG26?and xG24?devices and shared hardware and software development tools like Silicon Labs Simplicity Studios allows for easy development and seamless migration from other Silicon Labs Series 2?devices.
Learn more about how to begin developing cutting-edge IoT devices using Silicon Labs, be sure to?:
INFINEON INTRODUCES LOWER COST BLUETOOTH? LONG-RANGE MODULE, CYW20822-P4TAI040, FOR LOW POWER APPLICATIONS
This module is the most cost effective in its class, offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high performance, 英飞凌 CYW20822-P4TAI040?is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart home, asset tracking, beacons and sensors, and medical devices.
According to a recent report by ABI Research [1] , future use cases will demand additional improvements across almost all metrics. These include industrial IoT applications such as sensing, robotics, beacons, smart home, and asset tracking. In response, Infineon's CYW20822-P4TAI040?Bluetooth module delivers unparalleled connectivity and performance, enabling customers to create innovative products in the IoT and consumer electronics space.
With extensive experience in delivering certified Bluetooth and Bluetooth LE modules, Infineon’s regulatory testing (FCC, ISED, MIC, CE) and certification process with the Bluetooth SIG is precise and rigorous. Its pre-certified modules are optimized for cost, size, power, and range.
“Infineon is thrilled to expand its Bluetooth portfolio with the introduction of the CYW20822-P4TAI040?Bluetooth module to help designers get to market faster,” said Anurag Chauhan, Director of Marketing for the Bluetooth product line at Infineon Technologies. “As a leader in the IoT area in delivering innovative new Bluetooth LE solutions, this new module is a testament to our customer commitment. This new module delivers low power, long range, and excellent RF performance to meet our customers evolving needs.”
Key features of the CYW20822-P4TAI040?Bluetooth module
Availability
Infineon’s CYW20822-P4TAI040?Bluetooth LE module is currently sampling. More information is available Here .
About AIROC? Wireless Connectivity Products
Infineon’s AIROC wireless products, including Wi-Fi?, Bluetooth, Bluetooth Low Energy and Wi-Fi and Bluetooth combos, have shipped more than a billion devices and are the go-to choice for IoT solutions. The broad portfolio includes high-performing, reliable, ultra-low-power products that deliver robust industry-leading performance. [1] Source: ABI Research, The Continued Evolution Of Short-Range Wireless: New Technologies, Future Enhancements, And Emerging Market Opportunities.
MOUSER ELECTRONICS EXPANDS ANTENNA RANGE WITH NEW EMBEDDED, FLEXIBLE AND EXTERNAL WI-FI 6E SOLUTIONS
The introduction of IEEE's 802.11ax wireless standard brought forth several technical initiatives aimed at advancing connectivity for the next generation of devices. One key addition was the inclusion of Wi-Fi 6E, enabling Wi-Fi communication on the 6GHz spectrum for the first time. By operating at frequencies above the existing 2.4?and 5?GHz networks, Wi-Fi 6E enables better optimisation, less interference, and lower latency.
Security is also enhanced, as Wi-Fi Protected Access 3?(WPA3) certification is mandatory for all Wi-Fi 6E devices. Since its introduction in 2020, the deployment of Wi-Fi-6E has expanded to a diverse range of industrial and consumer locations, including offices, manufacturing facilities, clinical environments, and residential areas. Consequently, supporting Wi-Fi-6E has become essential for the latest high-performance wireless devices.
Mouser Electronics stocks a wide range of antenna designs needed to fulfil the diverse technical requirements of Wi-Fi 6E devices. Some of the newly added solutions include:
领英推荐
STMICROELECTRONICS EASES DEVELOPMENT OF SMALLER AND LONGER-LASTING SMART BLUETOOTH DEVICES
意法半导体 has released two new products to enable the next generation of better, smaller, and longer-lasting smart short-range wireless connectivity devices. The latest Bluetooth specification creates exciting opportunities for these to become even smarter, allowing designers to create items such as wireless beacons and devices that can calculate their location indoors with centimetre accuracy. Plus all the other convenient features Bluetooth is known for.
ST’s latest Bluetooth solutions cut the time for designers to understand the new specifications and put new product ideas into action. In today’s fast-moving markets for wireless products, the initiative lies with teams who can quickly conceive new products that offer novel and useful features.
ST’s new STM32WB09 wireless microcontroller puts all the processing power and Bluetooth radio-frequency technology needed in one chip that designers can put directly on their board ready to connect any other components. It comes with the latest Bluetooth 5.3?software and lets designers take advantage of the vast development ecosystem ST has built to support its STM32?microcontroller family. This includes PC-based design tools, essential software and sample code to accelerate application development.
The STM32WB09?IC, suitable for skilled designers, offers the advantage of a tiny chip-scale package option that is one of the smallest on the market today.
For customers who do not have access to extensive engineering skills and resources, ST offers the STM32WB1MMC wireless module. It makes wireless connectivity simple as it contains a certified wireless microcontroller pre-integrated with external components needed for the radio system, as well as the Bluetooth software, and so bypasses many of the engineering challenges encountered when designing with chips. The module helps product developers reduce project risks and build high-performing wireless products with only basic radio-frequency engineering skills. By doing so, customers can focus on developing their own firmware to add value as the wireless functionality will be easy to use.
To make its Bluetooth module even easier to use, ST has now introduced the B-WB1M-WPAN1?evaluation board that is ready to power up and start development. This board also contains movement, temperature, and barometric-pressure sensors that can be incorporated into the system, and other convenient features like an industry-standard connector for attaching an external antenna.
The STM32WB09?wireless microcontroller, STM32WB1MMC turnkey wireless module, and B-WB1M-WPAN1?module evaluation board are all in production now and ready for new design starts.
NORDIC ANNOUNCES NRF54L SERIES, EXPANDING INDUSTRY'S MOST EFFICIENT BLUETOOTH LE PORTFOLIO
Nordic Semiconductor , has announces a significant addition to its nRF54?Series, its fourth generation of Bluetooth? Low Energy Systems-on-Chip (SoCs). The nRF54L Series is the logical successor to the nRF52?Series, a product family that has seen several billion SoCs delivered to thousands of satisfied customers since its introduction in 2015.
The first SoC in the nRF54L Series, the nRF54L15, is perfectly suited for the next generation of wireless IoT products. The SoC targets medical/healthcare, smart home, industrial IoT, VR/AR, PC accessories, remote controllers, gaming controllers, and multiple other IoT applications. The nRF54L Series complements the recently announced nRF54H Series. While the nRF54L Series has wide applicability from high-volume products to more advanced devices, the nRF54H Series possesses the superior processing power and large capacity memory needed for IoT products that previously have been unfeasible.“
With the nRF54L Series, Nordic reinforces its position as the world’s leading Bluetooth LE company and a leader in low power wireless IoT technologies in general,” says Svenn-Tore Larsen, CEO, Nordic Semiconductor. “The company’s low power wireless engineering team is one of the best on the planet and, backed by an unwavering commitment to R&D investment, Nordic has once again redefined what’s possible with the technology. The new series will allow thousands of customers to markedly raise the performance and extend the battery life of their end-products while coming up with even more innovative designs.”
The nRF54L Series features a new hardware architecture fabricated using TSMC’s 22ULL? (22?nm) process technology. In comparison, the nRF54H Series is fabricated using the GlobalFoundries 22FDX? (22?nm) process. By investing in two wafer suppliers, Nordic increases the flexibility of its supply chains.“
We have gained valuable insights from the challenges posed by COVID-19. By strategically leveraging two distinct manufacturing facilities located in different regions, we are committed to enhancing supply chain diversification for the ultimate benefit of our customers and their risk mitigation efforts,” says Geir Langeland, EVP Sales & Marketing, Nordic Semiconductor.
Excellent processing power and efficiency
The nRF54L15?SoC features an Arm? Cortex?-M33?processor running at 128?MHz. The processor provides double the processing power of the nRF52840?SoC while reducing power consumption. Processing is supported by 1.5?MB of non-volatile memory and 256?KB of RAM, ample for concurrent running of multiple protocols.
“Our nRF52?Series SoCs are the world's most sold Bluetooth LE devices and it’s about time we step it up again to cover today's and tomorrow's applications,” says Kjetil Holstad, EVP Product Management, Nordic Semiconductor. “With the nRF54L15?we deliver what’s expected by a modern Bluetooth LE SoC, with increased performance and memory, and reduced power consumption making it a future-proof choice for your needs.”
Advanced security for the next generation of IoT
Given the growing importance of security in IoT, the nRF54L15?SoC incorporates advanced hardware and software security features ensuring its readiness for the next generation of IoT. It is designed for PSA Certified Level 3, the highest in the PSA Certified IoT security standard.
The SoC offers security services such as Secure Boot, Secure Firmware Update, and Secure Storage. Integrated tamper sensors can detect attacks and take protective action, while the cryptographic accelerators are hardened against side-channel attacks.
World-class multiprotocol radio
The nRF54L15?features a world-class multiprotocol radio that provides up to +8?dBm TX power (with 1?dB increments) with -98?dBm RX sensitivity for 1?Mbps Bluetooth LE. The radio includes a new 4?Mbps data rate option for 2.4?GHz proprietary protocols, with improved throughput, efficiency, and latency. It supports all Bluetooth 5.4?features, Bluetooth Mesh, Thread, and Matter. The radio is also equipped to support future Bluetooth specification updates.
The radio power consumption significantly improves in TX and RX compared with the nRF52?Series. For example, compared with nRF52840?SoC, the radio RX current is halved (running from a 1.8?V DC supply), resulting in major energy savings and allowing for more compact batteries or extended battery life.
More power-saving features
Further energy savings come from a new Global RTC (real-time clock) peripheral that can wake up the SoC from its deepest sleep mode, removing the need for an external RTC and significantly reducing power consumption for applications sleeping for long durations. This feature can enable multiyear battery life for certain products.
Ultra-compact packages
The nRF54L15?is now available for sampling in a 6?by 6?mm QFN package with 31?GPIOs. The SoC is also available in two ultra-compact 2.4?by 2.2?mm wafer-level chip scale packages (WLCSPs) with 32?GPIOs (300?μm pitch) and 14?GPIOs (350?μm pitch). These WLCSPs are more than 50?percent smaller than the nRF52840?WLCSP, making them suitable for designs with strict size constraints.
The nRF54L15?SoC is now available for sampling to selected customers. Interested parties can sign up for product updates at www.nordicsemi.com/nRF54L15 and can contact their local Nordic sales representative for more information.
Conclusion
In conclusion, Bluetooth technology has significantly transformed the landscape of electronics, providing users with unprecedented freedom and connectivity. As it continues to evolve with advancements in speed, range, and energy efficiency, Bluetooth remains a cornerstone of modern electronics, facilitating seamless communication between devices and enriching user experiences across various domains. Looking ahead, Bluetooth's influence is set to expand further, shaping the future of interconnected technologies and driving innovation in the electronics industry.