Wide bandgap for Aircraft Electrification, Cascode GaN, PowerUP day 3, Energy Efficiency and more!
Airbus and? 意法半导体 (ST)?have signed an agreement to collaborate on power electronics R&D to support more efficient and lighter power electronics, which are necessary for future hybrid-powered aircraft and full-electric urban air vehicles. The collaboration builds on previous evaluations conducted by both companies to investigate the advantages of wide-bandgap (WBG) semiconductor materials for aircraft electrification.
Riccardo Nicoloso, general manager of the new materials and power solutions division at ST, told Power Electronics News that the R&D collaboration will start with advanced research-and-test demonstrators around the e-motor control units, high- and low-voltage power converters and wireless-power–transfer systems in the frame of Airbus’s ZEROe roadmap and CityAirbus NextGen demonstrator.
Panel Discussion with Industry Experts, moderated by EE Times Editor Maurizio Di Paolo Emilio
Innovative power management devices improve power-factor correction and lower standby power consumption to offer energy-efficient solutions across all industrial, consumer and automotive applications. Almost all devices rely on some form of power conversion, whether it’s changing the voltage of a DC battery or converting AC mains electricity to DC. Power-conversion topologies need to be innovative and fresh to meet increasing performance and efficiency criteria. In this panel, the speakers will share their thoughts, the next challenges and new technology (such as WBG solutions) to support power conversion in different applications and markets.
Panelists:
- Andrea Bricconi, Chief Commercial Officer, Cambridge GaN Devices Ltd Devices?
- Mike Engelhardt, Qspice Creator, Qorvo, Inc.
- Darrel Kingham, CEO, Pulsiv
- Haachitaba Mweene, Senior Principal System Engineer Power & Signal Conversion, Nexperia
- Rob Weber, Product Line Director for Microchip Technology’s Silicon Carbide Business Unit, Microchip Technology Inc.
EV Power Conversion Fuels Growth in WBG Semiconductors
By Sonu Daryanani
At the?Advanced Automotive Tech Forum 2023?held in March, the focus was on the opportunities and challenges faced in the use of wide-bandgap (WBG) power electronics to meet the tremendous growth foreseen in the electric-vehicle market. In this article, we will highlight the presentation “Efficient 400-800V Charging & Conversion with GaNFast Power ICs & GeneSiC Trench-Assisted Planar Gate MOSFETs,” delivered by Dan Kinzer, COO/CTO of Navitas Semiconductor .
Cascode GaN improves efficiency – A teardown of Razer 280W Power Adapter
By Sonu Daryanani
Gallium nitride?is a wide-bandgap semiconductor that offers several advantages over traditional silicon-based devices, including higher efficiency, faster switching speeds and higher power density. Transphorm Inc.
Top-Side–Cooled RF Amplifier Modules Lead to Thinner, High-Performing 5G Radios
领英推荐
恩智浦半导体 , in pursuit of expanding in communication infrastructure, announced a new range?of top-side–cooled RF amplifier modules. These amplifiers embark on a packaging innovation by using gallium nitride multi-chip modules and top-side cooling. They are smaller, are proven to be cost-effective in their applications and are environmentally friendly.
Partnership Enables Energy-Efficient Silicon Carbide (SiC) Power Semiconductors
By Maurizio Di Paolo Emilio
Vitesco Technologies?has secured strategically significant capacities in energy-efficient silicon carbide power semiconductors through a long-term supply partnership with? ROHM Semiconductor Europe .?
Using Variable-Frequency DCM Control to Reduce Size of Efficient PFC Solutions
Variable-frequency discontinuous-conduction–mode (DCM) techniques used in the HiperPFS-5 family of power-factor–correction (PFC) boost converter ICs from Power Integrations provide a number of important benefits in reducing the size of efficient PFC solutions. HiperPFS-5 ICs are also the first use of PowiGaN power switches to reduce conduction losses, along with valley switching, delivering PFC efficiency of greater than 98% at 240 W.
How to reduce industrial CO2 emissions and increase energy efficiency?
Digital transformation strategies provide detailed insights into how motor-driven applications perform and help businesses save energy and lower CO2 emissions.
Littelfuse will acquire a 200 mm wafer manufacturing facility in Dortmund, Germany
By Maurizio Di Paolo Emilio
Littelfuse?announced it has entered into a definitive purchase agreement to acquire a 200 mm wafer fab located in Dortmund, Germany (“Dortmund fab”) from?Elmos Semiconductor SE.