Why Choose RF-60TC for High Frequency PCB Designs?

Why Choose RF-60TC for High Frequency PCB Designs?

In the realm of high power RF and microwave applications, the choice of materials can significantly impact performance and reliability. RF-60TC, a cutting-edge high-frequency laminate that combines advanced thermal conductivity with low dielectric losses. This ceramic-filled, glass-reinforced PTFE laminate is specifically engineered to optimize performance in demanding environments. With its unique properties, RF-60TC is poised to enhance the efficiency of various high power applications, particularly in miniaturized antenna designs.

Features of RF-60TC

RF-60TC boasts several technical specifications that make it a standout choice for engineers and designers. The material is composed of glass-reinforced PTFE ceramic composites, ensuring durability and thermal stability. It features a dielectric constant (Dk) of 6.15 at 10 GHz, which allows for effective signal propagation. Additionally, RF-60TC has a dissipation factor of 0.002 at 10 GHz/23°C, minimizing energy loss.

The thermal stability of RF-60TC is enhanced by its thermal coefficient of Dk, which is -3.58 ppm/°C across a range of -50°C to 150°C. This ensures reliable performance under varying conditions. The material also exhibits a low moisture absorption rate of 0.03%, which enhances its reliability in humid environments. Furthermore, RF-60TC demonstrates high thermal conductivity, with ratings of **0.9 W/M*K** (unclad), **1.0 W/M*K** (0.5 oz), and **1.05 W/M*K** (1 oz), significantly improving heat dissipation. Lastly, its coefficient of thermal expansion (CTE) measurements of 9.9 ppm/°C (X-axis) and 40 ppm/°C (Z-axis) contribute to enhanced dimensional stability.


Benefits of Using RF-60TC

The advantages of incorporating RF-60TC into high-frequency designs are manifold. Its improved loss tangent leads to increased efficiency in power transmission, while high thermal conductivity enhances heat dissipation, reducing operating temperatures and extending the lifespan of active components. Additionally, the excellent dimensional stability of RF-60TC ensures precise performance in multilayer PCB constructions.

The material’s stable dielectric constant over both frequency and temperature provides predictable electrical performance, which is critical in high-frequency applications. The excellent adhesion to metal facilitates reduced insertion loss, making RF-60TC an ideal choice. Moreover, its low moisture absorption further enhances reliability in various environments.


Artwork and Compliance

The artwork is provided in Gerber RS-274-X format and adheres to IPC-Class-2 standards, which ensures high-quality production and reliability.

Availability

RF-60TC is available worldwide, making it accessible for engineers across the globe. Its unique properties and robust performance metrics make it an ideal choice for a variety of high-frequency applications.


Typical Applications

RF-60TC is well-suited for a wide range of applications, including high power amplifiers, miniaturized antennas, GPS, patch, and RFID readers. It is also effective in filters, couplers, and dividers, as well as in satellite communications. Its ability to enhance efficiency and reliability makes it a critical component in modern RF and microwave systems.

Conclusion

RF-60TC represents a significant advancement in high-frequency material technology, offering a unique combination of thermal conductivity, low dielectric losses, and excellent dimensional stability. Its versatility in PCB construction and myriad applications positions it as a key player in the design of contemporary RF and microwave systems. As the demand for efficient, reliable, and compact solutions continues to grow, RF-60TC is set to play a important role in the future of high-frequency applications.



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