Where is COMS Chip going in Scientific and technological Progress liking Automatic Drive

Where is COMS Chip going in Scientific and technological Progress liking Automatic Drive

With Tesla using COMS chip camera in Automatic Drive,it have been going for intelligent?device.

Japan has fitted image sensors to its toilets, and technology is so ubiquitous that it can recognize not only faces, but license plates and now even "shit"!

Toilet with COMS camera

The AI toilet can be fitted with an image sensor on the back of the toilet seat so that when the user defecates, the toilet will instantly recognize the image of the stool. Defecation can be checked to improve the quality of living for the elderly. Let me imagine again: if the hospital stool inspection equipment also through a "laboratory sensor" data collection, the future this matter will not be so troublesome.

COMS HISTORY

  • In 1873, scientists Joseph May and WilloughbySmith discovered that selenium crystals generate an electric current when exposed to light. This led to the development of electronic imaging, and as the technology evolved, image sensors improved.?

Image sensor has gone through four stages, as shown in the figure below. Currently, the mainstream technology is CMOS image sensor.??

  • In February 1995, Photobit was founded to commercialize CMOS image sensor technology.??In November 2001,??Photobit/micron technology company acquisition.?

Coms image sensor structure and principle?

CMOS is known as imitation metal-oxidesiconductor, Chinese translation is complementary oxide metal semiconductor.??The manufacturing technology of CMOS is no different from that of ordinary computer chips. It mainly uses silicon and germanium to make semiconductors, so that the semiconductor with N (band - charge) and P (band + charge) level co-exist on the CMOS. The current generated by the two complementary effects can be recorded and interpreted into images by the processing chip.?

CMOS image sensor makes "camera on chip" possible, and the trend of camera miniaturization is obvious.?

CMOS image sensor (CIS) is the integration of analog circuit and digital circuit.??

It is mainly composed of four components:??

  • Micro lens,??

Having a spherical surface and a reticular lens;??As the light passes through the microlens, the inactive part of the CIS is responsible for collecting the light and focusing it into the color filter.?

  • Color filter (CF)

split the red, green and blue (RGB) components in the reflected light and form a Baer array filter through the photosensitive elements.?

  • photodiode

a photoelectric conversion device that captures light and converts it into an electric current;??Generally made of PIN diode or PN junction device.?

  • pixel design.?

Assembly on the CIS/active pixel sensor (APS) implementation.??APS, usually composed of 3 to 6 transistors, can obtain or buffer pixels from a large array of capacitors and convert photocurrent into voltage within the pixels, with perfect sensitivity levels and noise indicators.?

Each square on the sensor represents a pixel block, above which is attached a layer of color filter (CF). After the CF splits the RGB components in the reflected light, the SENSOR forms a Baer array filter.??The classical Bayer array imagines the RGB in a 2x2 four-cell scattered pattern, while the Quad Bayer array expands to 4x4 and aligns the RGB adjacent in a 2x2 pattern.??

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Light passes through lens → sensor (imaging onto COMS surface →COMS converts image into electrical signal) → analog-to-digital converter (converting electrical signal into digital image source file) → image processor (generating image file) → storage in memory (memory card, etc.)

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Through A/D/converter (ADC) Transverter *** converts analog signals into digital signals, which are then processed by software to achieve A/D processing of analog signals. corresponding to analog-to-digital conversion, The analog-to-digital conversion is the inverse process of analog-to-digital conversion.

ADC and DAC architectures commonly used in software radio include the following four categories:

  • (1) Parallel structure, Including Flash ADC and serial DAC
  • (2) a segmented structure including a foldable plug-in ADC and a "segmented" stepwise DAC;
  • (3) Iterative structure, Including [partition type ADC] point-type ADC and sequential approximation ADC;
  • (4) σ -△ structure includes σ -△ADC and DAC.

The technical requirements of software radio for A/D conversion include the following:

  • (1) sampling methods should be consistent with [] sampling theorem Anti-aliasing filter is added appropriately.
  • (2) wideband, such as digitalization of intermediate frequency analog signals, Signal bandwidth is usually more than a dozen trillion (hz) to tens of megahertz;
  • (3) Maintain high signal dynamic range;
  • (4) high sampling rate should work in medium or high frequency as far as possible, To ensure software processing at high frequencies as much as possible;
  • (5) Reduce the amount of noise.

Application?fields

  • Mobile Field

Sharp introduced the first camera-capable mobile phone in 2000; With the advent of the smartphone era, the quality of the main camera continues to improve; The number of mobile cameras has increased, and CIS shipments have doubled. In order to improve the quality of cameras, mobile phones have introduced dual-camera, even three-camera, four-camera, and the need for image sensors will grow. In addition, more and more manufacturers are adding facial recognition features. About face recognition articles please refer to: face recognition industry chain and investment opportunities.

  • 2.Vehicle Field

CIS applications in the automotive sector include: Rear view camera (RVC), [all-round view system] (SVS), Camera monitoring system (CMS), FV/MV, DMS/IMS system.

[car image sensor] Global sales are increasing year by year. Rearview camera (RVC) is a major sales force with a steady growth trend, with global sales reaching 51 million units in 2016, 60 million units in 2018 and 65 million units expected in 2019. The global sales volume of FV/MV grew rapidly, reaching 10 million units in 2016 and 30 million units in 2018. After that, it is expected that FV/MV will continue to maintain a rapid growth trend, with sales volume expected to reach 40 million units in 2019 and 75 million units in 2021, which is close to the global sales volume of RVC.

  • 3.Security field

At present, the cameras installed in the streets, all need to use image sensors, especially high-definition cameras. Some time ago, Jacky Cheung's concert helped catch several criminals who had been on the run for years, using cameras equipped with image sensors.

In 2015, the global security camera market sold about 280,000 pieces, including about 80,000 surveillance cameras and 200,000 security system cameras. It is estimated that by 2021, the sales volume of security camera market will be about 640,000 pieces, including about 220,000 pieces of surveillance camera, with a cagR of 18% and about 420,000 pieces of security system camera, with a CAGR of 13%.

  • 4.Medical imaging

Image sensors have multiple applications in the medical imaging market: X-ray, endoscopy, molecular imaging, optical coherence tomography, and ultrasound imaging.

The medical imaging equipment industry is a huge $35 billion market with a projected CAGR of 5.5% from 2016 to 2022.

The medical sensor market was $350 million in 2016 and is expected to grow at a cagR of 8.3% from 2016 to 2022, reaching $600 million by 2022.

Industry Competition Pattern

At present, SONY has always maintained a leading position in the field of image sensors, with 49.2% market share, topping the list of image sensors, 80% of sales to China, mainly with China is the world's largest smartphone market has a lot to do with.

The top six image sensor manufacturers accounted for 90.8% of the market. Samsung, [Howe technology] , On Form, SK Hynix and ST ([ST] ] ranked second to sixth.

From the overall image sensor market, SONY's position is hard to be shaken at present, but in the segment market, The market share is only 5.8% of Anson And Won the largest automotive CMOS supplier position with more than half of the market share.

Where is China's domestic COMS image sensor manufacturer? Before Howe Was acquired, the share was negligible. China's semiconductor started late with poor foundation, and the commercial CCD chip market was basically monopolized by SONY, Panasonic, Sharp and other Japanese manufacturers, completely missing the CCD era. And now, with the rise of CIS (COMS image sensor), can Chinese companies overtake on curves? On the one hand, domestic COMS image sensor manufacturers still need to continue to seek breakthroughs in technology; on the other hand, they can achieve fast catch-up through acquisition.

he shares The acquisition of Howe Technology has been completed in June 2019 Later, if you look at the performance of Vail stock this year, from 28 to a high of 116, you can see how high the market is pricing in, [earnings] up to more than 500 times. China is too short of this technology, especially today when trade protectionism is prevalent. "Independent and controllable, and shoring up weak links" is the goal our country pursues, and the policy will certainly give strong support in the future, so the market gives such a high valuation.

New features are transforming the CMOS image sensor industry, with a cagR of 10.4% over the next five years and a market size of $18.8 billion by 2021. Industry research agency Yole believes that the CMOS image sensor industry will maintain a high growth trend. The growth in the number of cameras in smartphones will offset the slow growth in smartphone shipments. Dual-camera and 3D camera will have a significant impact on CMOS image sensor shipments.

Recent Years

The consumer market in 2016 is recovering from the decline of digital photography. While motion cameras appear to have reached their market cap, new applications such as drones, robotics, virtual reality (VR) and augmented reality (AR) are bringing new life to the CMOS image sensor market. At the same time, the car camera market has become an important growth area for CMOS image sensors. The trend towards advanced driver Assistance systems (ADAS) further increases the pressure on sensor suppliers to improve their sensing technology capabilities. Image analysis is an emerging demand, and early applications of artificial intelligence are attracting attention. The automotive CMOS image sensor market is expected to grow at a cagR of 23% from 2016 to 2021. Therefore, we do not expect the global CMOS image sensor market growth to slow down until 2021. Similar to the automotive market, image analytics and performance improvements are driving production, security, medical and industrial markets.

Technological innovation is still the main driver of CMOS image sensors

Back-to-back (BSI) and stacked BSI technologies are on the rise. These technologies have made major breakthroughs that are changing the competitive landscape and the state of the market. Stacked BSI image sensors are layered with stacked pixels, including the formation of on-chip backlit structure pixels. The chip includes a circuit for signal processing, which will replace the supporting substrate used for traditional backlit CMOS image sensors. The image sensor can also integrate more functions, such as autofocus (AF) and optical stabilization (OIS).

Dual-camera technology for smartphones

Smartphone cameras basically has the following two driving factors: (1) size: camera module of X, Y, and Z size (2) image quality: especially in high resolution, low light performance, focus and stabilization "dual cameras" technology is changing the rules of the game, may be content to grab market share in a short time, push the CMOS image sensor industry growth. Another important scenario is that smartphone front-facing cameras are in the making, driven by human-computer interface technology. It is important to understand the impact of dual-camera and 3D sensing cameras on various industries, because these basic hardware are an important part of the Computational Revolution that will transform biometrics, machine vision, film and television entertainment, security surveillance, intelligent transportation, biomedical and many other fields.

The development path of CIS technology in the future will benefit from the following three aspects:

In 2010, back to image (BSI) CMOS image sensor technology began to develop and gradually occupy the mainstream of the market, has obtained more than 50% market share. Backshot is the key technology to achieve pixel size between 1.4 μm and 1.1μm. This technology enables 8 megapixel CMOS image sensors to enter the smartphone market, while allowing 24 megapixel CMOS image sensors to enter the SLR camera market.

Camera module dimensions (X, Y and Z dimensions) Image quality (resolution, sensitivity, focusing performance and shock resistance) functionality (slow-motion video, image analysis, motion control)

SONY still dominates the CMOS image sensor market:

Current mobile image sensors are almost made of CMOS material. Compared with previous CCD materials, the biggest advantage of this material is to reduce the power consumption of the chip, and also have better performance in noise and speed. And speaking of CMOS, SONY is a name does not open, it is not only a famous camera manufacturers, is the largest supplier of CMOS sensor now, contributing to market a variety of high-resolution, high sensitive, a new structure of the image sensor, so use SONY sensor has been typical of the high-end phones on the market, and manufacturers of booth, It's as if SONY is the only company in the market for image sensors. In fact, the current image sensor market competition is very fierce, and even Chinese manufacturers are participating in it through the operation of capital. This time, we take stock of the mainstream image sensor manufacturers.

SONY Exmor image sensor, except in the mobile market is dominant in the field of the camera, use not only their own camera, nikon, pentax, Olympus brands such as partial model also USES SONY sensors, support this powerful market appeal is SONY's unrivalled technical strength, such as stack type technology. In popular backlight sensor, pixel and processing circuit are located in the same plane, the lower layer is to support the substrate, the stack structure is to move the signal processing circuit above to replace the support substrate, overlapping on the chip to form the pixel part of the backlight sensor, so that the sensor area is greatly reduced; At the same time, because of the independence of pixel and circuit, manufacturers can optimize the pixel layer for high quality, and the circuit layer for high performance.

In terms of technology, Samsung has its own ISOCELL technology, which improves sensitivity by creating a physical barrier between adjacent pixels, reducing pixel crosstalk by 30% and increasing dynamic range by 30% compared to backlit sensors.

In 2015, Samsung launched the industry's first 16-megapixel S5K3P3 with a single pixel size of only 1μm and a thickness of 5mm. Although the single pixel size is too small to reduce the sensitivity, the application of ISOCELL technology makes up for the lack of saturation, and the official claim that the final imaging quality is equal to the 1.12μm size CMOS. More importantly, the slim S5K3P3 allows the slim phone to be designed with no protruding camera, striking the right balance between appearance and camera performance. With SONY's supply crunch in the middle of the year, Samsung is rumored to have snagged a lot of domestic customers, and we'll expect to see more domestic phones equipped with Samsung's image sensor soon.

OmniVisio, which ranks second only to SONY in mobile sensor market share, was acquired by a Chinese consortium of Huachuang Capital, Citic Capital and Goldstone Capital for $1.9 billion. Howe's image sensors were used in the iPhone in the early days, but when the iPhone 4S switched to SONY for the rear camera sensor, Howe's products were only used by Apple for the front camera, and with the rise of Samsung and Hynix, Howe's market share has been declining. In addition, Howe's sensor price is much lower than SONY, up to 6 or 7 times lower, the profit is naturally not as good as SONY. Among many manufacturers, Howe is a seriously underestimated manufacturer, whose limelight has been covered by SONY for a long time, hoping that its products can be selected by more manufacturers after being acquired by the Chinese consortium.

Since its inception, STMICROELECTRONICS has never wavered in its r&d strategy. Nearly a quarter of its employees work in product development and design, and r&d accounted for nearly 23% of total revenue in 2010. Stma is ranked as one of the most innovative companies in the semiconductor industry, with approximately 20,000 patents and patent applications pending. With a wealth of chip manufacturing processes, including advanced CMOS logic, mixed signal, analog and power manufacturing processes, STMICROELECTRONICS is a partner of the International Semiconductor Development Alliance (ISDA) to develop next-generation CMOS technologies.

SK Hynix has been in the CMOS image sensor business since 2007, becoming an IDM by acquiring the remaining stake in Siliconfle. In a short period of time, the company provides 8 million pixel products and has production lines for various products. In addition, SK Hynix plans to aggressively enter China, the world's largest CMOS image sensor producer and consumer market, by introducing competitively priced products to meet customers' demands.

Aptina Imaging is a global provider of CMOS imaging solutions with an expanding portfolio of products used by all leading mobile phone and laptop brands. Aptina also offers a wide range of products for digital cameras and camcorders, surveillance, medical, automotive and industrial applications, video conferencing, bar code scanners, toys and games. Aptina is committed to providing Imaging Everywhere for a variety of applications, driving innovations in the market, such as the introduction of the first 14MP CMOS image sensor for the point-and-shoot hybrid camera (MT9F001), And the industry's first inch format 5MP SOC (MT9P111). Aptina is privately held, with investors including Riverwood Capital, TPG Capital and Micron Technology.

Talking about CMOS, how can we not mention Canon? Canon's CMOS sensor has always been controversial, and its updating speed is far less than SONY's, which also makes Canon angry. But in December 2015, Canon announced that it had developed an APS-H size CMOS sensor (about 29.2x20.2mm). With a jaw-dropping 250 megapixels (resolution will be 19580x12600), the Canon 5DS and 5DS R, currently the highest-resolution digital SLR, have sensors that have "only" 50.6 megapixels and rely on full-frame (36x24mm) sensors.

Toshiba is the other big player in the Japanese market for imaging sensors for mobile cameras. There are probably no high-end smartphones with Toshiba imaging sensors anymore, But [nokia 808] Toshiba supplied the PureView camera's 41 megapixel imaging sensor.

More recently, Toshiba has been working to further reduce the size of smartphone imaging sensors and reduce power consumption. In March, Toshiba introduced a slow-motion T4K82 imaging sensor with 240fps. Toshiba is known for its 13-megapixel and 8-megapixel imaging sensors for smartphones, and also produces 20-megapixel imaging sensors for high-end smartphones. The HTC One M9's rear camera uses Toshiba's backview T4KA7 imaging sensor. Like SONY, Toshiba has integrated phase detection autofocus into its imaging sensors, has its own 3D depth mapping technology and bright mode technology to improve slow-motion video. Toshiba focuses on supplying sensors to Chinese smartphone makers and sees the automotive and medical equipment markets as opportunities for future growth. Toshiba also showed off some of the Project Ara module prototypes.

Much like Samsung, LG is both a component and a product maker and has made headway in camera components. LG Innotek, the component-focused division of LG, designed the camera in the latest G4 flagship phone. Unlike Samsung, however, LG does not make its own imaging sensors, but designs only the camera modules. All of LG's high-end smartphone cameras use SONY's Exmor imaging sensor. LG recently equipped its LG G4 with an F /1.8 aperture, which puts in about 80% more light than the F /2.2 aperture of the G3. LG's research team is also developing hardware components for its camera module. With the LG G3, LG announced a laser autofocus system, and the LG G4 comes with an infrared color correction circuit to better compensate for ambient light. By not having to focus on imaging sensor development, LG had more time to develop other modules and developed some interesting and useful camera designs.

Infineon's technology research in recent years will change the landscape of mobile phone photography. Infineon developed the REAL 3D image sensor chip with PMD Technologies LTD., based in Sigen, Germany. The two companies work together to provide technical support to customers. PMD's contribution to this newly developed chip family is the ToF pixel matrix. Infineon's contribution is to provide all functional components for system-on-chip (SoC) integration and to develop the corresponding manufacturing processes. The 3D image sensor chip is manufactured in Infineon's Dresden facility and is optimized for a time of flight (ToF) CMOS process using microlens technology.

Ams expands its CMOS image sensor market. Following the acquisition of NXP Semiconductor's (NXP) CMOS image sensor business in July, Austria's Microelectronics recently announced an agreement with CMOSIS, a supplier of high-end image applications and linear scan CMOS image sensors, to acquire 100 percent of its shares in cash.

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