What’s New in PICMG COM-HPC Specification 1.2
Patrick Hopper
Publisher, President #Influencer @ OpenSystems Media | Embedded | AI | IoT | Military | Aerospace | Embedded World Media Partner #ew25 #embeddedworld
Christian Eder , Chair of the COM-HPC working group and Director of Market Intelligence at congatec , shares?the key innovations in the?high-performance Computer-on-Module standard.
The COM-HPC specification has been around for two and a half years. How has demand developed during this time?
COM-HPC is designed for high-performance Computer-on-Modules that can be deployed both as modular servers and modular clients. There is great demand for such modules due to the growing requirements of digitization and IIoT, the use of artificial intelligence, vision-based situational awareness, and spiraling data processing needs. Developers working on new designs in these application fields have no doubt that COM-HPC modules are the right solution. Almost every second new project within the entire performance range of PICMG standards, which include COM Express and COM-HPC, uses COM-HPC, and first OEM solutions with 12th and 13th generation Intel Core processors and Intel Xeon D are already in series production. So, the launch of COM-HPC was extremely smooth, and acceptance high right from the start. The situation was very different when the COM Express specification was launched. We had to do a lot more convincing at the time. It is clearly a huge advantage to involve manufacturer-independent bodies such as the PICMG in the specification of new form factors.
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