What is the rank of 28 kinds Chip Packaging

1.BGA / Ball grid array

Also called Globe Top Pad Array Carrier (CPAC).Spherical contact display, one of surface mount type packages.A spherical convex point was made on the back of the printing substrate according to the display mode to replace the pins. LSI chip was assembled on the front of the printing substrate and then sealed by molding resin or potting method.??Also known as raised point display carrier (PAC).Pins can exceed 200, which is a package used for multi-pin LSI.Package bodies can also be made smaller than QFP(four-side pin flat package).For example, the BGA of 360 pin with 1.5mm pin center distance is only 31mm square;The QFP of 304 pins with a pin center distance of 0.5mm is 40mm square.And BGA does not have to worry about pin deformation like QFP.?

The package, developed by Motorola, was first used in devices such as portable phones and later popularized in personal computers.Initially, the BGA had a pin (bump) center distance of 1.5mm and a pin count of 225.Some LSI manufacturers are developing BGA with 500 pins.The problem with BGA is the appearance inspection after reflow welding.Motorola calls molded resin sealed packages MPAC and poach sealed packages GPAC.?

2.C-(ceramic)

Symbol for ceramic packaging.For example, CDIP stands for ceramic DIP.?Is a notation that is often used in practice.?

3. COB (chip on board)

Chip on board packaging is one of the bare chip mounting technologies. Semiconductor chip handover is mounted on the PRINTED circuit board. The electrical connection between the chip and the substrate is realized by lead stitching and covered with resin to ensure reliability.??Although COB is the simplest bare-chip mount technology, its package density is nowhere near as high as TAB and backchip welding.?

3.DIP(dual in-line package)?

Double in-line package.One of the plug-type packages,the pins lead out from both sides of the package, packaging materials are plastic and ceramic.European semiconductor manufacturers use DIL.DIP is the most popular plug-in package, including standard logic IC, memory LSI, microcomputer circuit applications.Pin center distance 2.54mm, pin number from 6 to 64.The package width is usually 15.2mm.Some packages with width of 7.52mm and 10.16mm are called SK-DIP(Skinny Dual In-line package) and SL-DIP(Slim Dual In-line package), respectively.In most cases, however, they are simply referred to collectively as DIP without distinction.In addition, a ceramic DIP sealed with a glass with a low melting point is also called Cerdip(4.2).

4.1 DIC(dual in-line ceramic package)

Nickname for DIP with glass seal in ceramic package.

4.2 Cerdip：DIP-G

Nickname for DIP with glass seal in ceramic package.Glass sealed ceramic double in-line package for ECL RAM, DSP, etc.Cerdip with glass window is used for ULTRAVIOLET erasing EPROM and microcomputer circuit with EPROM.Pin center distance 2.54mm, pin number from 8 to 42.In Japan, this package is indicated as diP-G (G stands for glass seal).?

4.3 SDIP (shrink dual in-line package)

Contractile DIP.One of the plug-in packages having the same shape as the DIP but with a smaller pin center distance (1.778mm) than the DIP(2.54mm)?

Hence the name.Pin count from 14 to 90.There are two kinds: ceramic and plastic.Also known as SH-DIP(shrink Dual In-line package)

5.Flip-chip

Reverse welding chip.??As one of the bare-chip packaging technologies, a metal bump is made in the electrode region of LSI chip, and then the metal bump is pressed and welded to the electrode region on the printing substrate.??The area occupied by the package is basically the same as the chip size.??It is the smallest and thinnest of all packaging technologies.??However, if the thermal expansion coefficient of the substrate is different from that of LSI chip, the reaction will occur at the joint, thus affecting the reliability of the connection.??Therefore, LSI chips must be reinforced with resin and substrate materials with approximately the same thermal expansion coefficient must be used.?

6、FP(flat package)

Flat package.One of surface mount type packages.Another name for QFP or SOP(see QFP and SOP).Some semiconductor manufacturers use this name.?

7.H-(with heat sink)

Represents a mark with a radiator.For example, HSOP stands for SOP with radiator.?

8、MCM(multi-chip module)

A package in which multiple semiconductor bare chips are assembled on a wiring substrate.According to the substrate materials, it can be divided into three categories: McM-l, McM-c and McM-d.?

McM-l is a component that uses the usual glass epoxy multilayer printing substrate.Wiring density is not very high, the cost is lower.?

McM-c uses thick film technology to form multilayer wiring with ceramic (alumina or glass ceramic) as the substrate component, similar to thick film hybrid IC using multilayer ceramic substrate.There is no significant difference between the two.The wiring density is higher than that of McM-l.?

McM-d is a multilayer wiring with ceramic (alumina or aluminum nitride), Si, Al as substrate components by thin film technology.Cabling plots are the highest of the three components, but also costly.?

9、P-(plastic)

Mark for plastic packaging. For example, PDIP stands for plastic DIP.

10、Piggy back

Pack-load packaging.Ceramic package with socket, similar to DIP, QFP, QFN.Used to evaluate program validation operations when developing equipment with microcomputers.For example, plug an EPROM into a socket for debugging.This kind of package is basically fixed product, the market does not circulate much.?

11、QFP(quad flat package)

One of the surface mount type packages with seagull wing (L) shaped pins leading from four sides.The base material has ceramics, metal and plastic 3 kinds.In terms of quantity, plastic packaging accounts for the majority.In most cases, plastic QFP is used when no material is specifically represented.Plastic QFP is the most popular multi-pin LSI package.Not only for microprocessor, door display and other digital logic LSI circuit, but also for VTR signal processing, audio signal processing and other analog LSI circuit.Pin center distance is 1.0mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm and other specifications.The maximum number of pins in the 0.65mm centerdistance specification is 304.?

Some LSI manufacturers call the QFP with a pin center distance of 0.5mm shrinker QFP or SQFP or VQFP.But some manufacturers pin center distance of 0.65mm and 0.4mm QFP also known as SQFP, to make the name a little confusion.?

In addition, QFP with pin center distance of 0.65mm and body thickness of 3.8mm ~ 2.0mm is called MQFP(Metric Quad Flat Package) according to JEDEC(United States Joint Electronic Equipment Committee) standard.According to the standard of Japan Electronic Machinery Industry Association, the lead center distance is less than 0.65mm, such as 55mm, 0.4mm, 0.3mm, which is called QFP fine pitch (QFP), and the small center distance IS QFP.Also known as FQFP(Fine Pitch QUad Flat Package).But now the Japan Electromechanical Industry Association has reassessed the QFP's shape specifications.There is no difference in pin center distance, but according to the packaging body thickness is divided into QFP(2.0mm ~ 3.6mm thick), LQFP(1.4mm thick) and TQFP(1.0mm thick) three.?

The disadvantage of QFP is that pins tend to bend when the pin center distance is less than 0.65mm.Several improved varieties of QFP have emerged to prevent pin deformation.For example, packaged BQFP with tree finger cushions at four corners (see 11.1);GQFP with resin protection ring covering pin front end;Test convex points are set in the packaging body, and TPQFP can be tested in the special fixture to prevent pin deformation.In logical LSI, many development products and high reliability products are packaged in multilayer ceramic QFP.Products with a minimum pin center distance of 0.4mm and a maximum pin count of 348 are available.In addition, glass-sealed ceramic QFP is also available (see 11.9).?

11.1 BQFP(quad flat package with bumper)

Flat four-side pin package with cushioning.One of the QFP packages, the four corners of the package body are provided with bumps (cushions) to prevent the pin from bending during transportation.Semiconductor manufacturers in the United States mainly use this package in circuits such as microprocessors and ASics.Pin center distance 0.635mm, pin number from 84 to 196 or so.?

11.2 QIC(QuAD in-line Ceramic Package)

It is another name for QFP.Name used by some semiconductor manufacturers.?

11.3 QIP(Quad in-line Plastic Package)

Another name for PLASTIC QFP.Name used by some semiconductor manufacturers.?

11.4 (PFPF)Plastic Flat Package??

Another name for plastic QFP.Name used by some LSI manufacturers.?

11.5 QFH(quad flat high package)

Four side pin thick body flat package.A plastic QFP, in order to prevent the packaging body fracture, QFP body made thicker.Name used by some semiconductor manufacturers.?

11.6 CQFP(quad fiat package with guard ring)

Flat four side pin package with guard ring.One of the plastic QFP, the pins are shielded with a resin protection ring to prevent bending deformation.Before assembling the LSI onto the printed substrate, cut the pin from the guard ring and make it a seagull wing (L shape).The package has been mass-produced by Motorola in the United States.Pin center distance of 0.5mm, pin number is about 208 at most.?

11.7 MQUAD(metal quad)

A QFP package developed by Olin Company, USA.??The substrate and cover are made of aluminum and sealed with adhesive.??The power of 2.5W ~ 2.8W can be allowed under natural air cooling conditions.??Nippon Shinko Electric Industries corporation was licensed to start production in 1993.?

11.8 L-QUAD

One of ceramic QFP.Aluminum nitride is used for packaging substrate, and its thermal conductivity is 7 ~ 8 times higher than alumina, and it has better heat dissipation.The frame is sealed with aluminum oxide and the chip is sealed by potting to keep the cost down.A package developed for logical LSI that allows W3 power under natural air cooling conditions.208-pin (0.5mm center spacing) and 160-pin (0.65mm center spacing) LSI logic packages have been developed and started mass production in October 1993.?

11.9 Cerquad

One of the surface mount packages, namely the ceramic QFP with the lower seal, used to encapsulate the logical LSI circuit such as DSP.Cerquad with Windows is used to encapsulate EPROM circuits.Better heat dissipation than plastic QFP, in natural air cooling conditions can allow 1.5 ~ 2W power.But the packaging cost is 3 ~ 5 times higher than plastic QFP.Pin center distance is 1.27mm, 0.8mm, 0.65mm, 0.5mm0.4mm and other specifications.Pin count from 32 to 368.?

12、QFG (quad flat J-leaded package)

One of surface mount packages.The pins lead from the four sides of the package in a j-shape downward.It is the name stipulated by the Japan Electronic machinery Industry Association.Pin center distance 1.27mm.The materials are plastic and ceramic.?

Plastic QFJ is mostly called PLCC(Plastic Leaded Chip Carrier),which is used in microcomputer, door display, DRAM, ASSP, OTP and other circuits.Pin count from 18 to 84.?

QFJ is also known as CLCC(Ceramic Leaded Chip Carrier) and JLCC(J-Leaded Chip carrier).The package with window is used for ULTRAVIOLET erasing EPROM and microcomputer chip circuits with EPROM.Pin count from 32 to 84.?

13、QFN(quad flat non-leaded package)

Four - side pin - less flat package, one of the surface mount type package, high - speed and high - frequency IC package.Now it's called LCC.QFN is the name prescribed by the Japan Electronic Machinery Industry Association.The four sides of the package are equipped with electrode contacts. Due to the absence of pins, the mount occupies a smaller area and a lower height than QFP.However, when stress occurs between the printing substrate and the package, it cannot be relieved at the electrode contact.Therefore, the number of electrode contacts is difficult to achieve as many as the pins of QFP, generally from about 14 to 100.?

The materials are ceramic and plastic.When there is a LCC mark, it is basically ceramic QFN.Center distance of electrode contact 1.27mm.Plastic QFN is a low cost package based on glass epoxy printing substrate.In addition to 1.27mm, there are two kinds of electrode contact center distances: 0.65mm and 0.5mm.These packages are also known as plastic LCC, PCLC, P-LCC, etc.?

13.1 PCLP (Printed Circuit Board Leadless Package)

Printed circuit boards are packaged without leads.??

13.2 P-LCC(The name used by Fujitsu for plastic QFN)

Pin center distance is available in 0.55mm and 0.4mm specifications.It is currently under development.??

14. QFI(Quad Flat I-Leaded Package Gage)

Four side I pin flat package.One of surface mount type packages.The pins lead from the four sides of the package, down in the i-shape.Also known as MSP(Mini Square Package).The mount is welded to the printing substrate.Since there is no protruding part of the pin, the area occupied by the mount is less than QFP.Hitachi Productions developed and used this package for video analog ics.In addition, Japan's Motorola PLL IC also uses this package.Pin center distance 1.27mm, pin count from 18 to 68.

15、TCP(Tape Carrier Package)

It is mainly used on Intel Mobile Pentium MMX.The HEAT of THE CPU using TCP packaging technology is much smaller than the ordinary PGA pin array CPU at that time. It can reduce the volume of additional heat dissipation device and improve the space utilization rate of the host computer.Therefore, it is more common in some ultra-thin notebook computers.But because TCP package is the CPU directly welded on the motherboard, so ordinary users are unable to replace.

15.1 DTCP(dual tape carrier package)

Dual-pin on-load Encapsulation.One of TCP(loaded encapsulation).The pins are made on the insulating tape and lead out from both sides of the package.The package is very thin due to the use of TAB(automatic load welding) technology.Often used for LCD drive LSI, but most of the fixed products.?

In addition, a 0.5mm thick memory LSI book package is under development.In Japan, according to EIAJ(Japan electronic machinery Industry) standards, DTCP named DTP.?

15.2 QTCP(quad tape carrier package)

Four side pin load package.A TCP package in which pins are formed on the insulation tape and lead out from the four sides of the package.Is the use of TAB technology of thin packaging.In Japan,it is called QUad Tape Carrier Package (QTP).?

15.3 Tape Automated Bonding (TAB)

Tape Automated Bonding (TAB) is a multi-pin large-scale integrated circuit (IC) Chip (Chip), no longer the traditional packaging into a complete individual, and use the TAB carrier, directly unsealed Chip glued on the board.The soft tape of Polyimide and the inner and outer pins etched by copper foil are used as the carrier, and the large chip is first bonded to the inner pins.After automatic testing, the circuit board surface is combined with "external pins" to complete assembly.This packaging and assembly into one new construction method, known as TAB method.?

16、PGA(pin grid array)

Display pin package.A plug-in type package in which the vertical pins on the underside are arranged in a display pattern.Basically, multilayer ceramic substrates are used for packaging.In the case that the material name is not specifically indicated, most of them are ceramic PGA, used for high-speed large-scale logical LSI circuits.The cost is high.The pin center distance is usually 2.54mm, the pin length is about 3.4mm, and the pin count ranges from 64 to about 447.In order to reduce the cost, the packaging substrate can be replaced by glass epoxy resin printing substrate.Also available in 64 to 256 pin plastic PGA.In addition, there is a pin center distance of 1.27mm, pin length 1.5mm~2.0mm short pin surface mount TYPE PGA(PGA), half smaller than the plug-in TYPE PGA, so the packaging body can be made not very large, and the number of pins than the plug-in type (250 ~ 528).?

17、LGA(land grid array)

Contact display package.That is, the package of electrode contact of array state tank is made on the bottom surface.Plug into the socket when assembling.The ceramic LGA with 227 contacts (1.27mm center distance) and 447 contacts (2.54mm center distance) is now in use for high-speed logical LSI circuits.LGA can accommodate more input and output pins in a smaller package than QFP.In addition, because of the low impedance of the lead, it is suitable for high-speed LSI.?

18. LSI

On-chip lead encapsulation packaging technology.The front end of the lead frame is on top of the chip, and there is a convex welding spot near the center of the chip.The chip is about 1mm wide in a package of the same size, compared to the original structure where the lead frame is placed near the side of the chip.?

19、QUIP(quad in-line package)

Quad in-line package, also referred to as QUIL.The pins lead from two sides of the package, each other crisscrossed down into four columns.The pin center distance is 1.27mm, which becomes 2.5mm when inserted into the printing substrate.Therefore, it can be used for standard printed circuit boards.It is a smaller package than standard DIP.Nec uses several types of packaging in microcomputer chips for desktop computers and home appliances.The materials are ceramic and plastic.Pin count 64.

20、SOP(small Out-Line package)

Small form factor package.One of the surface mount type packages, the pins lead from both sides of the package in the shape of a seagull wing (L shape).The materials are plastic and ceramic.It is also called Small out-of-line L-Leaded package (SOL), Dual Flat package (DFP), Smallout-line Integrated Circuit (SOIC), and dual Small (DSO)Out-of-lint) this name is used by many semiconductor manufacturers abroad.?

SOP is not only used in memory LSI, but also widely used in ASSP circuits.SOP is the most popular surface-mount package in areas with no more than 10 to 40 input/output terminals.Pin center distance 1.27mm, pin number from 8 to 44.?

With the development of SOP, it is gradually derived:?

· SSOP with lead center distance less than 1.27mm (reduced TYPE SOP);?

· TSOP less than 1.27mm (thin and small shape package);?

·VSOP(Very small form factor);TSSOP(thin shrink type SOP);?

·SOT(Small Form Factor Transistor);SOP with heat sink is called HSOP;?

· Some semiconductor manufacturers call the sops without heat fins Small out-of-line non-fin (SONF).?

· some manufacturers call the broad-body SOP SOW (SmallOutlinePackage(wide-jype))?

21、MFP(mini flat package)

Plastic SOP or SSOP.Name used by some semiconductor manufacturers.

22、SIMM(single in-line memory module)?

Single-column memory component.A memory assembly with electrodes only near one side of the printing substrate.Usually a component that plugs into a socket.The standard SIMM has two specifications: 30 electrodes with a center distance of 2.54mm and 72 electrodes with a center distance of 1.27mm.SIMM, which is equipped with 1-megabit and 4-megabit DRAM encapsulated with SOJ on one or both sides of the printing substrate, has been widely used in personal computers and workstations.At least 30-40% of DRAM is assembled in SIMM.?

23、DIMM(Dual Inline Memory Module)

A DIMM is similar to a SIMM except that the two gold fingers of a DIMM can communicate with each other. They transmit signals independently, thus meeting the requirements for data signal transmission.The DUAL in-line memory module (SDRAM) has a 168-pin DUAL in-line memory module (DIMM). The gold finger has two bayonet slots to prevent DIMM damage caused by reverse insertion.The DDR DIMM uses a 184-pin DIMM structure. Each gold finger has a 92-pin slot and only one bayonet.Bayonet number of different, is the most obvious difference between the two.?

DDR2 dimms have a 240pin structure and a gold finger with 120 pins on each side. The same as DDR dimms, the gold finger has only one bayonet, but the bayonet position is slightly different from that of DDR dimms. Therefore, DDR dimms cannot be inserted into DDR2 dimms.In the same way, a DDR2 DIMM cannot be inserted into a DDR DIMM. Therefore, a DIMM cannot be inserted into a wrong slot on a mainboard that provides both DDR and DDR2 DIMMs.?

24、SIP(single in-line package)

Single inline package.European semiconductor manufacturers use SIL (single - in-line) this name.The pins are drawn from one side of the package and arranged in a straight line.The package is in a lateral position when assembled on a printing substrate.Pin center distance is usually 2.54mm, pin count from 2 to 23, most custom products.Packages come in different shapes.Other packages that have the same shape as ZIP are called SIP.

25、SMD(surface mount devices)

Surface mount device.Occasionally, some semiconductor manufacturers classify SOP as SMD.?

26、SOI(small out-line I-leaded package)

I pin small shape package.One of surface mount type packages.The pins lead down from both sides of the package in the shape of I, with a center distance of 1.27mm.The area occupied by mounting is less than SOP.Hitachi uses this package in analog IC(motor drive IC).Pin number

27、SOJ(Small Out-Line J-Leaded Package)

J pin small shape package.One of surface mount type packages.The name derives from the fact that the pins lead down from both sides of the package in a J-shape.Usually plastic products, most used in DRAM and SRAM and other memory LSI circuits, but the vast majority of DRAM.Most DRAM devices packaged with SOJ are assembled on SIMM.Pin centers are 1.27mm apart and the number of pins ranges from 20 to 40(see SIMM).?

28、TO package

Its chassis is a round metal plate,and then put on a piece of small glass and heating, the glass melting after the lead fixed in the hole, the hole and lead combination known as the head seat, so the first in the head seat above gold, because the bottom of the integrated circuit section is also gold, so can be by gold, germanium welding wax to welding;When welding, first preheat the head seat, so that the welding wax is completely melted, and then put the circuit section on the welding wax, after cooling, the two form a good joint.?