What are the pros and cons of blind vias versus through-hole in PCB layout design?
buried or blind vias have to be done with drilling processes on each individual pair of layers in the board. That would be three drilling passes and setups on a 6-layer board, four for an 8 layer board.
Thru vias have a single drilling pass per board design.
So clearly buried and blind vias add steps and therefore costs but do not double it... each layer pair already required lamination and photoetching steps.
The benefit of blind and buried vias is that it frees up PCB surface space for top or bottom mounted components, and routing space on top, bottom and some internal layers. Each thru via that is used but connects only two layers together wastes routing space for components and traces on the layers for which the via does not have to traverse to make its connections.
So it frees up some but not a whole lot of space allowing for more circuit density. It does complicate testing as it makes more nodes not probe-able.
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Schematic Capture, PCB Design, Mixed Signals, Signal Integrity
8 年Juan Abelaira, look for my portfolio, blind vias had used only at flash storage where flashes was at both sides of the board. Against via stub you can use back drilling. As for me, I like blind or buried vias, but if customer had put restriction because cost of xx-layer board with them will fly to space, I have to avoid them.
Electronics and FPGA expert. Team lead
8 年I can't figure out how to route a 900+ ball BGA with 0.8 mm pitch without using them to some extent. Another reason is with high speed signals a full via creates a stub that may affect the signal.
Schematic Capture, PCB Design, Mixed Signals, Signal Integrity
8 年Generally we must keep in mind cost of production, so usually we avoid using extra blind or buried vias if it's possible because of their triple value (especially while prototyping). But if you can use them, it's very good to simplify the topology, reducing via stub without back drilling and adding space for routing.
Electronic Design Consultant
8 年Actually, I used blind vias on a board that had microprocessors but also power distribution. Top and layer 1 was the microprocessors with vias only between top and layer 1. Layer 2 and bottom were plane layers for high power distribution. This way, I didn't turn my plane layers into "Swiss cheese".