#Solder #paste is one of the commonly used raw materials in #PCBA factories. Choosing the right solder paste according to different products and #processes can effectively improve production #quality. Here I will briefly introduce the common methods of selecting solder paste:
- Solder paste is generally divided into high, medium and low temperature solder paste according to the #temperature. These need to be considered comprehensively based on the actual number of #reflow soldering times of the board and the temperature requirements of the #PCB and #components.
- The cleanliness of the board and the cleaning process after #soldering are also common reference factors for us to choose the type of solder paste. For example, the no-clean process requires the use of #halogen-free and non-corrosive compound no-clean solder paste, the solvent cleaning process requires the use of solvent cleaning solder paste, and the water cleaning process requires the use of water-soluble solder paste.
- The #storage time and #surface #oxidation of PCB and components are also within our consideration. Generally, #KJRMA grade is adopted. R grade can be selected for products with higher reliability requirements, and #RA grade is required for products with long storage time or severe surface oxidation.
- The alloy powder particle size of the solder paste is also a parameter that needs to be selected, which needs to be selected based on the actual assembly density of #SMT welding.
- Select the viscosity of solder paste according to the solder paste coating process and assembly #density. High-density printing requires high viscosity, while drip coating requires low viscosity.
If you have more suggestion or additions, please comment below.
