What Is Flex PCB material
Flexible Copper Clad Laminate, composed by metal foil (generally copper foil),insulating film and binder materials with different functional,the material can be easy bend and flexure. Flexible printed circuit boards (FPC) has developed rapidly in recent years, and its output is close to the output of rigid pcb. FPC widely used in portable communication equipment, computers, printers and other fields.
In recent years, 2 layer FCCL has been developed in order to reduce the thickness of FPC, improve flexibility, heat resistance and peel resistance to meet high performance and thin PCB. It does not require adhesives, and is directly composed of flexible insulating materials and copper foil.?It is the preferred material for flexible substrates in Rigid-Flex PCBs.?
The main flexible sheet material has copper clad foil polyester film, copper clad polyimide film, copper clad polyimide fluorocarbon film and thin epoxy glass coated copper sheet (thin FR-4).
Copper-clad polyester film（PET）
The mechanical properties of copper-clad polyester film are better in tensile strength, dielectric constant and insulation resistance. It also has good anti-moisture and dimensional stability after moisture absorption. Disadvantages are poor heat resistance, large size change after heating, and lead bad welding.The working temperature is lower (below 105 degrees C). PET is only used in printed transmission lines without welding and flat cables in electronic machines.
Copper-clad polyimide film（PI）
The copper clad foil polyimide film has good electrical properties, mechanical properties, flame retardancy, chemical resistance and weather resistance. The most prominent feature is high heat resistance,the glass transition temperature of Tg is higher than 220. The disadvantage is that the hygroscopicity is high, and the shrinkage rate is high and the cost is high at high temperature or after moisture absorption, Pre bake to remove moisture before PCB welding. PI is suitable for flexible printed boards for high-speed circuit microstrip or strip line signal transmission, it’s also one of the most widely used substrates in flexible substrates.
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Thin epoxy glass cloth copper clad plate
Thin epoxy glass cloth copper clad laminate is a flexible substrate developed in recent years. The thin FR-4 PCB is better than the traditional FCCL in moisture resistance performance of external insulation in addition to flexural performance, Dimension stability and other comprehensive properties. At present, it has been applied to banded IC package and the cost is lower than the PI board.
The other flexible PCB are different according to the demand. In recent years, a flexible copper clad plate with special materials has been developed, such as fluorocarbon film, aromatic polyamide paper, polysulfone film and liquid crystal polymer (LCP) film.
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