What equipment is needed for chip testing? The main method of chip function test

In recent years, the market demand for semiconductor equipment in mainland China has been growing rapidly. Under this background, the high precision testing equipment which must be used for chip wafer testing also has an increasingly broad market. Since each functional component has its own testing requirements, the design engineer must make test planning early in the design process. This article collected some information, hope to readers have a relatively large reference value.

1. What equipment is needed for chip testing?

The first one: test machine

Test machine is a special equipment to test the function and performance of the chip. During the test, the test machine applies the input signal to the test chip, and the output signal is compared with the expected value to judge the electrical performance of the chip and the effectiveness of the product function. In the CP and FT detection links, the test machine will transmit the results to the probe station and the sorting machine respectively. When the probe station receives the test results, an inkjet operation is performed to mark the defective chip on the wafer. When the separator receives the results of the self-test machine, it will select and classify the chips.

The second one: probe machine

The probe platform is used for CP testing after wafer processing and before packaging process. It is responsible for wafer transportation and positioning, so that the grains on the wafer contact the probe successively and test one by one. The working process of the probe table is as follows: move the wafer under the wafer camera through the slide table -- take the wafer image through the wafer camera to determine the wafer position -- Move the probe camera under the probe card, determine the probe head position -- move the wafer under the probe card -- realize the needle alignment through the vertical movement of the slide table.

The third one:Sorting machine

The sorting equipment is used in the FT test after the chip packaging. It is the back channel test equipment that provides the function of chip screening and classification. The sorter is responsible for transporting the input chip to the test module to complete the circuit pressure test according to the system design. In this step, the sorter selects and classifies the circuit according to the test results.

Two:chip function test commonly used several methods

There are six common methods for chip function testing, including board level testing, wafer CP testing, FT testing after packaging, system-level SLT testing and reliability testing.

?The first kind: board level test, mainly used in functional testing, using PCB board + chip to build a "simulated" chip working environment, the chip interface is drawn out, test the function of the chip, or in a variety of harsh environment to see whether the chip can work normally. The equipment to be applied is mainly instrumentation, and the main one to be made is EVB evaluation board.

The second type: System-level SLT testing, often used in functional testing, performance testing and reliability testing, often exists as a supplement to finished FT testing. As the name implies, it is to test in a system environment, that is, to put the chip in its normal working environment to run functions to test its quality. The disadvantage is that only part of functions can be covered. Coverage is low, so it is generally a supplement to FT.

?The third kind: reliability test, mainly for the chip to impose a variety of harsh environment, such as ESD static electricity, is to simulate the human body or the simulation of industrial body to add instant high voltage to the chip.

?The fourth type: FT test of finished products after packaging, which is often used in functional testing, performance testing and reliability testing to check whether the chip function is normal and whether there are defects in the packaging process, and to help test whether the chip can still work after "fire snow thunder" in reliability testing.

?Fifth: wafer CP test, often used in functional testing and performance testing, to understand whether the function of the chip is normal, and to screen out the fault chip in the chip wafer.

Sixth: Multiple strategies.

?In summary, in the semiconductor design, manufacturing, packaging in each link to carry out repeated detection, testing to ensure product quality, so as to develop a device that meets the requirements of the system. Defect related failures are costly, ranging from tens of dollars at the IC level to hundreds of dollars at the module level to thousands of dollars at the application level. Therefore, testing equipment from the design verification to the whole semiconductor manufacturing process has an irreplaceable important position. Our company has professional engineers and the industry elite team, has 3 standardized laboratories, the laboratory area is more than 1800 square meters, can undertake electronic components testing verification, IC true or false identification, product design material selection, failure analysis, function testing, factory incoming material inspection and tape and other testing projects.