What is the difference between a rapid temperature change test chamber and a cold and hot shock test chamber?

Features Differences:

1.Temperature change rate: The rapid temperature change test chamber generally changes the temperature at 1℃-30℃?per minute; the cold and hot?shock test chamber can complete the instantaneous switch from high temperature to low temperature within 3-5 minutes.

2.Temperature range: The rapid temperature change test chamber is usually -55℃ to 125℃; the cold and hot?shock test chamber is generally -65℃ to 150℃.

3.Structural design: The rapid temperature change test chamber is a single-box structure; the cold and hot?shock test chamber is mostly a two-box or three-box structure.

4.Sample processing method: The samples in the rapid temperature change test chamber are usually placed statically; the cold and hot?shock test chamber often uses a dynamic method to quickly switch?the samples between high and low temperatures.

5.Test time: The rapid temperature?change test chamber has a relatively long test time; the cold and hot?shock test chamber has a short test?time.

6.Equipment cost: The rapid temperature change test chamber is relatively low in price and maintenance cost; the cold and hot?shock test chamber is high in price and maintenance cost.

Different applications:

Rapid temperature change test chamber: commonly used in mechanical electronics and plastics industries. In terms of automotive parts testing, it can ensure that parts can adapt to temperature fluctuations in different seasons or geographical locations; in electronic product thermal cycle testing, it can verify the stability of product performance in frequent temperature changes; it is also suitable for aerospace industry, automation equipment, electrical engineering, electrical, communications, metal and other industries to test product performance problems caused by changes in physical or chemical properties of product materials in high and low temperature rapid changes.

Cold and Hot shock test chamber: mainly used in electronics, automobiles, aerospace and other industries, it can test the performance of electronic components under extreme temperature differences, such as integrated circuits, connectors, PCB boards, etc.; it is also used in the field of materials science, especially to test the durability of composite materials under extreme temperature changes, and can also test the durability of automotive parts.

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