What Are the Advantages of Using A Hybrid PCB with RO4003C and S1000-2M Materials?
What Are the Advantages of Using A?Hybrid PCB with RO4003C and S1000-2M Materials?
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Introduction:
In the fast-paced world of electronics, the demand for high-frequency and low-loss circuit boards continues to drive innovation. To meet these requirements, we present our newly shipped Hybrid PCB, incorporating the advanced materials RO4003C and S1000-2M. Designed for superior performance and cost-effective fabrication, this 6-layer PCB offers exceptional characteristics for RF microwave circuits, matching networks, and controlled impedance transmission lines. In this blog, we delve into the features, construction details, and potential applications of this cutting-edge hybrid PCB.
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1. Introduction to RO4003C:
Rogers RO4003C materials are a breakthrough in PCB technology, combining the excellent electrical properties of PTFE/woven glass with the manufacturing feasibility of epoxy/glass. The result is a low-loss material that can be fabricated using standard epoxy/glass (FR-4) processes at competitive prices. With its unique composition, RO4003C offers superior high-frequency performance and opens up new possibilities for RF microwave circuit design.
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RO4003C materials are specifically tailored to meet the needs of high-frequency designers, providing low dielectric loss and enabling applications that were previously limited due to operating frequency constraints. Furthermore, RO4003C laminates utilize various configurations, all of which meet the same electrical performance specifications. It is important to note that these materials are non-brominated and not UL 94 V-0 rated, making them an environmentally friendly choice.
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2. Features of RO4003C:
2.1 Dielectric Properties:
RO4003C exhibits impressive dielectric properties that contribute to its exceptional performance:
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- Dielectric Constant (DK):
Primarily measured at 3.38 +/- 0.05 at 10GHz, this property ensures stable signal propagation throughout high-frequency applications.
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- Dissipation Factor:?
With a value of 0.0027 at 10GHz, RO4003C minimizes signal loss, enabling efficient signal transmission.
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- Thermal Conductivity:?
The material's thermal conductivity is 0.71 W/m/°K, facilitating effective heat dissipation within the PCB.
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- Thermal Coefficient of Dielectric Constant:?
RO4003C exhibits a negligible variation in dielectric constant over a wide temperature range, demonstrating stability and reliability.
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- CTE Matched to Copper:
The material showcases a CTE matched to copper, with X-axis at 11 ppm/°C and Y-axis at 14 ppm/°C.
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- Low Z-Axis Coefficient of Thermal Expansion:?
RO4003C maintains a low coefficient of thermal expansion, measured at 46 ppm/°C.
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- High Glass Transition Temperature (Tg):
The Tg of RO4003C exceeds 280°C, ensuring excellent thermal stability even under demanding conditions.
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- Low Moisture Absorption:
RO4003C has a low moisture absorption rate of 0.06%, preventing performance degradation caused by humidity.
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2.2 Features of S1000-2M:
The S1000-2M substrate, combined with RO4003C, enhances the Hybrid PCB's performance further:
- Lower Z-Axis CTE:?
The S1000-2M exhibits a lower coefficient of thermal expansion, significantly improving trough-hole reliability.
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- Excellent Mechanical Processability and Thermal Resistance:
S1000-2M offers superior mechanical processability, making it ideal for various manufacturing processes. It also exhibits exceptional thermal resistance, ensuring reliable functionality under demanding operating conditions.
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- Lead-free Compatibility:
With lead-free compatibility, the PCB meets environmental standards and supports future sustainability goals.
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- High Heat Resistance:
S1000-2M possesses high heat resistance, enabling reliable operation under elevated temperature scenarios.
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- Excellent Anti-CAF (Conductive Anodic Filament) Performance:
The material's anti-CAF properties prevent conductive filament formation, enhancing long-term reliability.
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- Low Water Absorption:
S1000-2M exhibits low water absorption, protecting the PCB's electrical characteristics from moisture-related issues.
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What are the advantages of using a Hybrid PCB with RO4003C and S1000-2M materials?
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High Frequency Performance:
RO4003C is a high-frequency laminate material known for its excellent electrical properties. It offers low insertion loss, low dielectric constant, and tight control over impedance, making it ideal for applications that require high-frequency performance. S1000-2M, on the other hand, is a versatile material with good electrical properties, suitable for RF and microwave applications.
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Design Flexibility:
Hybrid PCBs allow for the combination of different materials to optimize the board's performance. By using RO4003C and S1000-2M materials together, designers can take advantage of the unique properties of each material to achieve specific design goals. This combination provides flexibility in designing circuits with different impedance requirements and can help achieve higher performance.
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Cost Optimization:
Hybrid PCBs offer the opportunity to optimize costs while maintaining performance requirements. By strategically using RO4003C and S1000-2M materials, designers can allocate the high-performance material where it's most needed while using the cost-effective material in less critical areas. This approach helps balance the overall cost of the PCB without compromising performance.
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Thermal Management:
RO4003C and S1000-2M materials have different thermal properties. By using a hybrid PCB with these materials, designers can benefit from improved thermal management. They can strategically place components on the board to leverage the different thermal conductivity and heat dissipation capabilities of the materials, ensuring optimal thermal performance.
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Reliability and Durability:
Both RO4003C and S1000-2M materials are known for their reliability and durability. Hybrid PCBs using these materials can withstand harsh operating conditions, such as high temperatures and high-frequency signals, while maintaining their electrical performance and mechanical integrity over time. This ensures a longer lifespan and higher reliability of the overall electronic system.
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Miniaturization:
?The combination of RO4003C and S1000-2M materials enables the design of compact and miniaturized electronic systems. RO4003C offers excellent electrical properties in a thin form factor, allowing for high-density circuit designs. S1000-2M, with its versatile characteristics, complements the design by providing a cost-effective material for less critical areas, enabling further miniaturization of the overall PCB assembly.
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These advantages make hybrid PCBs with RO4003C and S1000-2M materials an attractive choice for applications such as telecommunications, aerospace, automotive, and high-speed digital circuits that require high-frequency performance, reliability, cost-optimization, and thermal management.
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3. PCB Stackup:
The Hybrid PCB features a 6-layer rigid construction that optimizes signal integrity and reliability:
- Copper Layer 1: 35 μm
- RO4003C: 0.305 mm (12 mil)
- Copper Layer 2: 35 μm
- Prepreg: 1080 RC63% 0.0644 mm (2.5 mil)
- Copper Layer 3: 35 μm
- S1000-2M: 0.203 mm (3 mil)
- Copper Layer 4: 35 μm
- Prepreg: 1080 RC63% 0.0644 mm (2.5 mil)
- Copper Layer 5: 35 μm
- RO4003C: 0.305 mm (12 mil)
- Copper Layer 6: 35 μm
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4. Artwork and Standard Compliance:
The Hybrid PCB complies with industry-standard specifications and is designed for ease of use:
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- Artwork Format:
Gerber RS-274-X artwork ensures compatibility and allows for seamless integration into existing design workflows.
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- Accepted Standard:
The Hybrid PCB adheres to the IPC-Class-2 standard, guaranteeing reliability and interoperability.
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- Worldwide Availability:
This groundbreaking Hybrid PCB is available for purchase worldwide, ensuring accessibility for customers across the globe.
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5. Typical Applications:
The Hybrid PCB excels in a wide range of applications, including but not limited to:
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- Commercial Airline Broadband Antennas:
The PCB offers exceptional performance in the demanding environments of commercial aircraft.
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- Microstrip and Stripline Circuits:
With its low dielectric loss and controlled impedance characteristics, the PCB enables precise transmission line design.
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- Millimeter Wave Applications:
The Hybrid PCB facilitates the development of millimeter wave systems, achieving high-frequency performance and reliability.
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- Radar Systems:
The PCB's properties make it an ideal choice for radar systems that require accurate signal transmission and low loss.
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- Guidance Systems:?
The high-performance capabilities of the Hybrid PCB contribute to reliable guidance systems in various industries.
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- Point-to-Point Digital Radio Antennas:
The PCB provides the necessary characteristics for efficient point-to-point digital radio communication.
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Conclusion
The Hybrid PCB featuring the RO4003C and S1000-2M materials offers outstanding performance and reliability for high-frequency applications. With the capabilities of the RO4003C material combined with the benefits of the S1000-2M material, this PCB provides unparalleled flexibility, signal integrity, and thermal management. From commercial airline antennas to guidance systems, this PCB caters to a wide array of applications. Experience the power of hybrid technology by integrating our advanced Hybrid PCB into your designs and unlock the next level of electronic performance.