Weekly Industry Highlights (Weekly 10 for 2025)
Market: Aerospace Semiconductors, DRAM, HBM
1. The Aerospace Semiconductor Market is Expected to Reach $15 Billion by 2034
According to a report published by Market.US on February 24, the global aerospace semiconductor market is projected to reach $15 billion by 2034, up from $7.1 billion in 2024, with a compound annual growth rate (CAGR) of 8% from 2025 to 2034. In 2024, North America accounts for 38% of the market, generating approximately $2.6 billion in revenue, while the U.S. market is expected to grow at a CAGR of 6.2%.
Market expansion is primarily driven by the increasing demand for advanced aerospace technologies such as satellite systems, autonomous aircraft, and high-performance communication networks, alongside the need for lightweight, energy-efficient components. Additionally, the growing complexity of modern aircraft and spacecraft is accelerating the miniaturization and high-performance development of semiconductor technologies. The rise of the aerospace sector in the Asia-Pacific region also presents new opportunities for market growth.
2. Server DRAM and HBM Drive Q4 2024 DRAM Industry Revenue Up 9.9%
In Q4 2024, global DRAM industry revenue reached $28 billion, a quarter-over-quarter increase of 9.9%. Growth was mainly fueled by rising Server DDR5 prices and the concentrated shipment of High Bandwidth Memory (HBM). Increased procurement of high-capacity Server DDR5 by U.S.-based Cloud Service Providers (CSPs) has supported server memory price hikes.
Looking ahead to Q1 2025, the industry is expected to experience a seasonal slowdown, leading to reduced shipments. Meanwhile, PC OEMs and smartphone manufacturers will continue inventory adjustments, likely causing DRAM contract prices to decline.
3. Samsung Partners with YMTC on Advanced Packaging Technology
On February 26, Samsung and Yangtze Memory Technologies Co. (YMTC) announced a partnership to integrate YMTC’s hybrid bonding technology in Samsung’s 10th-generation NAND (V10) products. YMTC is a pioneer in applying hybrid bonding to 3D NAND and has accumulated significant intellectual property in this area. This collaboration helps Samsung mitigate patent risks while accelerating the mass production of its next-generation products.
Hybrid bonding replaces traditional bump connections with wafer-to-wafer (W2W) technology, shortening circuit paths, enhancing chip performance, and improving thermal efficiency. This technology holds a competitive edge in AI computing and high-performance computing applications. By 2030, demand for related equipment is projected to reach 1,400 units, with a market size exceeding €2.8 billion ($3 billion), largely driven by AI processing demands.
Original Manufacturer Updates: ADI, Micron, SK hynix
4. ADI Expects Strong Growth in Industrial, Automotive, and Communications in FY 2025 Q1
According to a SemiMedia report on February 24, Analog Devices Inc. (ADI) reported strong performance in industrial, automotive, and communications segments for the fiscal quarter ending February 1, 2025. The company’s revenue reached $2.423 billion, with significant quarter-over-quarter growth in these sectors and double-digit year-over-year growth in consumer electronics. The company’s gross margin was 59.0%, and operating margin stood at 20.3%.
CFO Richard Puccio stated, “Order volume continues to improve, and the industrial and automotive segments remain robust. We anticipate ADI will maintain growth momentum in Q2 FY 2025.”
5. Micron Begins Shipping 1γ nm DDR5 DRAM Samples
On February 25, Micron Technology announced it had started shipping samples of its 1γ nm DDR5 DRAM to select customers. The newly released 16Gb DDR5 memory achieves speeds of up to 9,200 MT/s, delivering a 15% performance boost, 20% lower power consumption, and 30% higher capacity density compared to its previous generation. Micron has applied Extreme Ultraviolet (EUV) lithography at its Hiroshima plant and received subsidies from Japan’s Ministry of Economy, Trade, and Industry. This technology aims to meet the growing demand for high-performance, low-power memory in AI and data center applications.
6. SK hynix Nears Completion of Intel NAND Business Acquisition
According to a February 26 report, SK hynix is set to finalize its acquisition of Intel’s NAND business by making a final payment of $2 billion in March. The acquisition process began in 2020, with the first phase completed by the end of 2021. Upon completion, SK hynix will enhance its competitiveness in the enterprise SSD market, particularly as AI-driven data center demands continue to expand.
Industry Information: Humanoid Robots, Quantum Chips
7. Rising Global Interest in Humanoid Robots
Research from TrendForce indicates that the U.S., China, Japan, South Korea, and Germany lead the world in industrial robot installations, with an estimated $13 billion in related projects expected by 2025. The U.S. dominates humanoid robotics through companies like Tesla and Boston Dynamics, focusing on manufacturing, warehousing, and logistics applications with AI-powered high-performance chip integration. Meanwhile, China is emphasizing supply chain development and independent innovation in key components, with several manufacturers gaining traction in international supply chains.
Over the next five years, humanoid robots will see significant price segmentation and differentiated applications. The emergence of regional ecosystems will drive localized production and industry growth.
8. Trump Administration Plans to Tighten Chip Restrictions on China
According to a Bloomberg report on February 24, the Trump administration is planning to implement stricter semiconductor export controls on China, building on the Biden administration’s policies. Proposed measures include:
9. Amazon Launches Its First Quantum Computing Chip
On February 27, Amazon (AMZN) announced the launch of its first quantum computing chip. Previously, competitors like Microsoft (MSFT) and Alphabet (GOOGL) had made strides in quantum computing. Amazon Web Services (AWS) revealed the Ocelot chip, which is still in the prototype stage. AWS stated that its quantum computing efforts aim to accelerate the timeline for delivering practical quantum solutions.
According to AWS, “Ocelot represents a breakthrough in building fault-tolerant quantum computers capable of solving critical business and scientific problems that classical computers cannot.”