Week in Review: CES - Innovation Through Iteration
Patrick Hopper
Publisher, President #Influencer @ OpenSystems Media | Embedded | AI | IoT | Military | Aerospace | Embedded World Media Partner #ew25 #embeddedworld
It’s my last day roaming the halls at this CES celebrating the 100th Anniversary of the CTIA, and despite the encroaching exhaustion (don’t worry, it’s my fault) and probable stress fractures in my feet (a hyperbole, but not-inaccurate assessment), it’s been a really great week.
The energy of CES 2024 is about pushing forward, adapting, and making the tactical and incremental advancements that are where real engineering and development live. Today, many of the folks I spoke to weren’t showing off “new” technology, but instead improvements upon existing tech and materials for current application needs. Don’t take that as a criticism because it is quite the opposite. The ever-hungry hype cycle and the driving need to announce the “best-in-class industry-leading bleeding-edge” new device or “killer app” is perhaps useful in marketing (doubt), but engineering needs more down to earth thinking to be truly productive, collaborative, and inventive. And that’s what I saw from so many of the folks I’ve interviewed this week. Read full report.
An Open Platform for Software-Defined Vehicles: Expectations vs. Reality
There are always a handful of technologies and buzzwords floating around the forefront of the embedded space and beyond — they promise unimaginable innovations, to be The Next Big Thing in x industry. Technologies like artificial intelligence, the Internet of Things, open source, or software-defined vehicles.
But sometimes, these big umbrella terms have a crossroads that makes them more tangible for users and developers — more applicable to real-life customer needs. Take the Eclipse Foundation , for example, who have formed a working group of several key industry players to develop an open technology platform for software-defined vehicles. Read more.
Embedded Computing Design Launches Embedded AI & Machine Learning E-newsletter, LinkedIn Newsletter, and AI Days
Embedded Computing Design, an OpenSystems Media (OSM) property, announces its new Embedded AI & Machine Learning E-newsletter and LinkedIn Newsletter in January 2024 (distributed weekly). With a combined circulation of more than 13,000 engineers globally, coverage in the newsletters will include such AI-related topics as IoT, Machine Learning, Computer Vision, Robotics, TinyML, Safety/Security, Industry 4.0, Edge Computing, and Sensors. It will also provide coverage of CES,?Embedded World, Mobile World Congress, NVIDIA GTC, Computex, and Sensors Converge.
In conjunction with the new E-newsletters, Embedded Computing Design will expand its popular AI Day Virtual Event into a monthly series highlighting the hottest topics relevant to its engineering community. Embedded Computing Design is the recognized leading source of “how-to” technical articles, videos, blogs, conferences, and podcasts for design engineers. Read more.
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