Week in Review: Axiomtek’s CEM561 COM Express? Type 6 Module with 13th Gen Intel? Core?
Patrick Hopper
Publisher, President #Influencer @ OpenSystems Media | Embedded | AI | IoT | Military | Aerospace | Embedded World Media Partner #ew25 #embeddedworld
Today’s advanced edge computing applications are often met with high-performance computing, flexibility, and scalability demands. Because of the spaces?these solutions are deployed in, from machine control and automation in rugged industrial IoT environments to human-machine interfaces in healthcare environments, the solutions utilized?must meet?these demands?and much more.
The CEM561 from Axiomtek USA is a COM Express? Type 6 compact CPU module featuring the 13th/12th Gen Intel? Core? i7/i5/i3 or Celeron? processor (Raptor Lake U/Alder Lake U), and an integrated SoC. Read more.
Soracom Utilizes GenAI fot IoT Applications
SORACOM unveiled two offerings intended to expedite the deployment of larger, more complex IoT projects by embedding Generative AI (GenAI) features more comprehensively within the IoT connectivity stack.
"We've always envisioned an Internet of Things where connected devices can interact with each other to make decisions in real time," said Kenta Yasukawa , Soracom CTO and co-founder. "The emergence of public GenAI services holds the potential to fulfill that vision. Soracom Flux and Soracom Query Intelligence drive AI much deeper within the IoT stack. Project teams can now accomplish in minutes what once took months and required expert skills, and even nontechnical managers can now enjoy complete control of even the largest and most globally distributed IoT networks." Read more.
FADU’s CEO, Jihyo Lee, to Co-Keynote at the 2024 Future of Memory and Storage
At the 2024 FMS: the Future of Memory and Storage (FMS), FADU’s CEO, Jihyo Lee , will co-keynote with Meta 's Ross Stenfort and Western Digital 's Eric Spanneut unveiling next-generation datacenter solutions focused on low power and high efficiency.
The keynote theme, “Navigating AI,” includes the introduction of FADU's enterprise SSD Controllers and CXL Solutions designed for AI Datacenters. The session titled “Hyperscale Flash Standards and eSSD Innovation” will explore new features critical for the future of AI-era storage and innovations in enterprise SSDs and Controllers. The co-keynote will also examine the effects of standardization efforts through the Open Compute Project (OCP). Jihyo Lee will present FADU’s strategies for embracing next-gen enterprise SSD solutions, highlighting leadership in Gen5 and Gen6 Controllers and top-performing SSD solutions.
Nothing is Impossible... During Assembly Testing!
The latest requirements are constantly challenging test engineers with new tasks.
The increased use of highly integrated electronic circuits is presenting new challenges for test engineers in manufacturing. Miniaturization often limits the number of applicable test methodologies. Test systems proven over several decades, such as in-circuit test (ICT) or flying-probe test, are reaching their limits because it is no longer possible to contact all the points needed for good coverage. Read more.
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