Webinar: How to Choose the Correct Heat Sink Attachment
Advanced Thermal Solutions, Inc. (ATS) will provide a free engineering training webinar:
"How to Choose the Right Heat Sink Attachment for Component Packages of All Sizes and Shapes" on Thursday, October 17 at 2:00 PM EST.
Choosing the right heat sink is part of deploying a good thermal management solution, the other part is the attachment method. Whether clip, push pin, z-clip, or other, the attachment has an important impact on how effective the thermal solution is. This webinar will cover these issues including attachments for rectangular packages increasingly used in SoC and SiP packages. A handy technical reference sheet and white paper on attachment types will be provided to those who register.
This webinar, presented by ATS Product Engineering Manager, Greg Wong will address all these issues and more. The presentation will run for 60 minutes, followed by 30 minutes of QA with participants. The webinar will be recorded and sent to participants for future reference.
Contact your local Astrorep/Envision sales rep for more details: www.envisiondt.com