Wafer Cutting

Wafer cutting, also known as wafer dicing or wafer sawing, is the process of cutting a silicon wafer into individual chips. These chips are called dies.?

How it works

• A wafer is a thin, round slice of semiconductor material, like silicon.?
• The wafer is mounted on a dicing tape with a sticky backing.?
• The wafer is cut into individual chips using a laser, mechanical sawing, or breaking.?
• The chips are then packaged for use in electronic devices.?

Why it's important?

• Wafer cutting allows manufacturers to create many identical circuits on a single wafer.
• The chips are used in integrated circuits (ICs) and other semiconductor devices.

What methods are used?

• Laser dicing

A non-contact method that uses a focused laser beam to vaporize the material along the cut lines.?

• Mechanical sawing

A method that uses a machine called a dicing saw with a diamond-coated blade.?

• Wire sawing

A method that uses a high-speed wire with diamond abrasives to slice the wafer.?

Source :https://link.springer.com/article/10.1007/s42452-022-05146-1

https://www.metallurgical-research.org/articles/metal/abs/2021/06/metal210320/metal210320.html

1) Optimization method of cutting parameters of wafer dicing saw based on orthogonal regression design

2) Recent advances of silicon wafer cutting technology for photovoltaic industry