Visiting our Japanese Partners
Mt. Fuji with Sakura ?Daniel Hehn

Visiting our Japanese Partners

Two weeks ago my colleague Klaus Aschauer and I had the chance to visit our Japanese Business Partners for the first time in 2023.

After COVID hit, the direct flight connections between Austria and Japan are still not available all year round, so we had to take some detour via Zurich. Unfortunately - like with almost all my flights currently - we had a few hours of delay.

Several factory visits were on our dense travel itinerary but after our late arrival on Easter Monday I had to cancel one supplier visit.


Nevertheless I was able to visit our partners:

  • SERIA Corporation (Screenprinting, Vacuum Plugging & Printed Electronics)
  • Viamechanics Co. Ltd. (Laser and Mechanical Drilling of IC Substrate and Substrate Core)

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  • ORC Manufacturing Co. Ltd. (DI Exposure down to 4um L/S)

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  • Nikko Materials Co. Ltd (Vacuum Lamination)

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Klaus even had one more trip to the Okinawa Area hence we separated several times on this trip.

Together with our partners we are bracing ourselves for an intense H2/2023, for which we are happy to be working with such industry leaders for high tech equipment in the microelectronics and PCB industry.

In three weeks I will return to Japan for the JPCA show, I would be happy to not only meet our suppliers but also some of our customers.

If you are planning on visiting JPCA, please let me know and I would be happy to schedule a meeting at one of our suppliers booths!

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