Visit us at SEMICON Taiwan 2024 Booth R8030

Visit us at SEMICON Taiwan 2024 Booth R8030

As one of the leading solder materials providers to the power #electronics assembly industry, our #Jufeng team is excited to showcase our #innovative products at SEMICON Taiwan, Sep 4-6, in Taibei!

Our solutions are designed to realize low-temperature bonding and high-temperature service that can not be achieved by other interconnect materials, such as #SliverSintering.

Among our featured products, we will be showcasing:

?? High density, miniaturization, cmd multifunction of electronic component.

?? Development of wide bandgap semiconductor for high temperature devices.

?? A new approach to sinter technology, available in both silver and copper sinter pastes, designed for high throughput applications such as die-attach and substrate-attach.For more information on our cutting-edge solutions for power electronics, visit us at #SEMICON in hall 2, stand #R8030.We look forward to meeting you there!

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