Unlocking tomorrow: How innovative techniques are redefining chip performance

Recently, I had the opportunity to play around with a pair of AI-enabled glasses and was struck by their ingenuity and design. We are all used to wearable gear to be bulky and cumbersome, and, while current smart glasses aren’t quite where we would want them to be, we are now moving in a direction where they can be designed to be more intuitive with our lifestyle. This shift is mainly driven by rapid technological advancements that have reshaped our world over the past years.

As I looked at the specific glasses, I realized the future of these needs a whole high-performance computer inside them. One that is a lightweight and energy-efficient solution, while accommodating a battery that lasts without being a single gram too heavy. Ultimately, we need the power of a smart phone integrated into the tiny area of these glasses. What a technical challenge!

Traditional silicon-based technologies are approaching their physical limits in size and performance, requiring the industry to explore new materials and innovative techniques to sustain and enhance performance. This transformation is not just about keeping pace, but also about meeting the escalating demands of emerging technologies such as smart glasses, artificial intelligence, and the Internet of Things (IoT).

I will look at three techniques in this blog that will help us balance tighter spaces while not sacrificing computing capabilities: transistor architecture, interconnects, and advanced packaging. Applying these, we can push the boundaries of performance and efficiency. Together, they represent a holistic approach to overcoming the physical limitations of traditional scaling, enabling the continued evolution of smaller, faster, and more powerful electronic devices.

1.?????? Transistor architecture is evolving to be more robust and versatile

For decades, planar transistor designs dominated the semiconductor landscape. However, the move to three-dimensional FinFET architectures revolutionized transistor efficiency and performance by increasing gate control over the channel. Now, the industry is advancing towards Gate All Around (GAA) architecture, where the gate wraps entirely around a nanowire or nanosheet. From my perspective, GAA transistors are an exciting next step in delivering significantly better energy efficiency as they promise superior electrostatic control, reduced leakage, and enhanced scalability compared to FinFET. This shift will enable a new wave of hardware to meet the demands of new technological advancements.

2.?????? Future interconnects are needed to keep up with higher performing devices

The evolution of semiconductor interconnects is crucial for meeting the demands of higher performance and lower power consumption. Traditional copper interconnect structures are facing limitations in terms of resistance, capacitance, and reliability as transistor sizes shrink. To address these challenges, we are exploring alternative materials that will offer lower resistivity and capacitance to enable faster signal transmission and reduced power consumption. Personally, I am interested to see the incorporation of Molybdenum, a chemical element with a high melting point. As it offers favorable resistance and capabilities and lowers the risk of electromigration, a main failure mechanism in small interconnects, it makes it a good alternative to traditional options.

3.?????? Advanced packaging builds heterogeneous chips for future performance boosts

Advanced packaging technologies are pivotal for enabling the integration of multiple chips and components into a single package, thereby enhancing overall system performance and functionality. New methods, such as Fan-Out Wafer-Level Packaging (FOWLP) and Through-Silicon Via (TSV), improve integration densities, facilitate better thermal management, and signal integrity. This is exciting because advanced packaging allows us to incorporate diverse functionalities, such as memory, processors, and sensors into a compact space, which is essential for anything from high-performance computing to mobile devices.

Shaping tomorrow’s innovations by enabling today’s R&D work

The current phase of evolution in the semiconductor industry represents a historic moment marked by transformative technological advancements. Looking ahead, the adoption of new transistor architecture, advanced interconnect materials, and innovative packaging techniques will define the future landscape of semiconductor technology. Fifty years from now, this era may be recognized as pivotal in driving the next wave of technological innovation across industries.

As the semiconductor industry progresses towards smaller, taller, and more powerful technologies, we at Merck Electronics are laser-focused on enabling new technological shifts and collectively pushing the boundaries of what is possible. By embracing new materials and advancing manufacturing techniques, we are paving the way for a future where semiconductor technology continues to be a cornerstone of innovation, progress, and more tech-savvy devices for the next generation.