Unlocking Efficiency in Semiconductor Validation with Mikros TU3 Thermal Test Head

About The TU3 Thermal Test Head

The Mikros TU3 is engineered to accelerate semiconductor validation and deliver rapid results. Here's a closer look at what sets the TU3 apart:

Precision at its Core:

• Embedded heaters and precision fluid controls ensure control over your testing environment.
• Full mechanical gimbaling to provide tight temperature control of chips during their various stages of testing.

Adaptability is Key:

• Originally designed for seamless integration into existing Automated Test Equipment (ATE).
• The TU3's thermal control technology is highly customizable, catering to a diverse range of test setups.

Swift Thermal Transients:

• Time is of the essence in semiconductor validation, and the TU3 delivers.
• Experience the fastest thermal transients available on the market, saving valuable time in your validation process.

Key Features

• ??? High Cooling Capacity: Utilizing microchannel flow paths.
• ? Fast Thermal Transients: Integrated heater designs for rapid temperature changes.
• ??? Easy Serviceability: Quick disconnect hoses for streamlined maintenance.
• ?? Removable Cold Plates: Facilitates easy integration with new processors.
• ??? User Interface: Intuitive interface for performance tracking.
• ?? Durability Tested: Withstands up to 1 million insertions.

System Performance

• ??? Cooling Capacity: 50W/C-cm2 (for 800W-1kW processors).
• ?? Thermal Transient: 80 degrees C drop in < 2 sec.
• ??? Temp Range: -20 degree C – 105 degree C.
• ?? Data Logging: Automatic and manual tracking of thermal data.
• ??? Control Modes: DUT Temp Control & Cold Plate Temp Control.
• ?? Compliance: X-Y: 1mm, Tilt: 5 degrees from horizontal.

Explore Further

The TU3 thermal test head data sheet for semiconductors is now available on our website.

View TU3 Data Sheet

In The News

The TU3 won 2022 NH Tech Alliance Product of the Year. Here is what the community said about it:

“The TU3 unlocks a global semiconductor supply chain bottleneck by empowering the reliable testing of next-generation processors at required temperature extremes. It is now being deployed by AMD worldwide.” READ MORE

“There’s no limit to what problems technology and innovation can solve here in New Hampshire.” READ MORE

#TU3 #SemiconductorValidation #ThermalTestHead #MorePowerToYou