unique features presented on the Control 2019 in Stuttgart

The Control show starts on Tuesday. As many competitors we want to demonstrate our capabilities. Since not everyone can visit the exhibition I just picked up a few applications in the form of 3D scans.

There aren't many devices on the market which combine the abilities to measure structures with the height up to several mm combined with the ability to measure structures with an max. height below 1 nm...

Once you find a device, which can measure the same samples with an similar resolution - I doubt that it can do it with the same resolution, the same speed...

• crack area with mm structures
• honing structures measured in a tube with 30 mm diameter
• roughness standard Ra 25 nm
• wafer polishing with scratches below 1 nm
• sharp cutting edge measured with a 20x objective
• membrane measured with a single scan
• siemens star proving the lateral resolution
• insert - live digitalization with an height resolution of 1 nm and an point density of 2 μm in 2 min.
• glass blasted surface with shine concave areas
• sharp needle with highly sloped flanks
• large grinded area
• solder points / planarity test
• line structures with a width below 0.1 μm