uHDI PCB advantage

Compared with the subtractive etching process currently used, UHDI can significantly reduce the size and mass of products, and the PCBs produced can be smaller and thinner.

· Improved reliability: Factors such as reduced number of layers, reduced lamination times, and reduced reliance on microvias can improve product reliability.

· Improved signal integrity: As mentioned above, the increase in the ratio of trace height to width provides PCB designers with more room to play, and strict control of feature size can also improve impedance control.

· Reduced cost: This may sound counterintuitive, and it is difficult to be absolutely fair when comparing costs. With UHDI technology, the number of layers and lamination times will be reduced, and the overall size of the PCB will be reduced, all of which can simplify the design, improve yield, and reduce costs.

· Biocompatibility: The A-SAP process can completely remove copper foil and add a thin layer of chemical copper plating on the dielectric. This process is not limited to generating copper layers, but can also generate gold and platinum conductive layers. This technology uses polyimide or LCP, providing a biocompatible solution for medical applications.PCB007