TSMC OIP: 3DFabric Alliance and 3Dblox

TSMC OIP: 3DFabric Alliance and 3Dblox

Paul McLellan Paul McLellan

Paul McLellan

Blogger at EDAgraffiti

发布日期: 2022年11月3日
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The press meeting at the recent OIP was all about 3DFabric and 3Dblox. If you don't know what those are, then read on. I've said before that advanced packaging is the hottest area in semiconductors right now.

I wrote about other aspects of OIP in my recent post?TSMC OIP: FinFlex, Analog, mmWave, and Awards.

Dr. Kevin Zhang

Before I get to the two big announcements of the day, it's worth taking a look at TSMC's advanced packaging portfolio. This was presented by Dr. Kevin Zhang, who is SVP of Business Development. I think, in some ways, they have simplified the portfolio from a few years ago.

This is the basic portfolio of advanced packaging that goes under the name 3DFabric. There is TSMC-SoIC, InFO, and CoWoS (and yes, the capitalization really is weird on all of them). More details on each below.

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First, InFO (see diagram above). This has been in high-volume production, especially in mobile, for eight years.

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