TeraSi raises 13 MSEK to build the next generation of wireless components and packaging.
KTH Holding AB
KTH Holding invests in startup companies and IP from KTH, Royal Institute of Technology.
The next generation of wireless will push us to higher frequencies than ever before, bringing massive data rates, unprecedented spatial resolution and a host of new applications to life. For the first time we will exploit frequencies as high as 200 GHz - almost ten times higher than mm-wave systems - at scale. As with all generational shifts, this change is only possible with new technologies that surpass the limitations of today. Decades of academic research has given us chips which can operate at such high frequencies. But we’re still lacking a way to package these chips and build complete systems around them in an efficient, scalable manner.
The TeraSi team is delighted to announce they have raised 13 MSEK in a pre-seed round to drive the development of their proprietary system-in-package technology and address this challenge head on. TeraSi’s technology offers best-in-class size, weight and performance for applications above 60 GHz by combining innovative design, precision manufacturing and process automation. The funding comes from leading venture capital firms Navigare Ventures, Almi Invest, Onsight Ventures and Deeptech Labs as well as follow-on investments from KTH Holding and other existing investors
TeraSi’s goal is now to implement the first system-in-package modules based on their technology and bring them to market alongside their unique passive components. In the longer term, the company plans to open up their technology to realise its full potential.
TeraSi’s first step is to expand their engineering team to meet customer demand. The funding will also allow the team to invest in new manufacturing infrastructure and pursue an aggressive IP strategy. Commercial launch of new products for the test and measurement, radar and wireless markets will follow.
“Before we can realise society’s visions of the next generation of wireless we need to build hardware to support it. We believe our technology offers the best combination of performance, compactness and volume scalability and solves the packaging and integration bottleneck above 60 GHz. We’re excited to start scaling our technology and show its true potential over the coming years.” James Campion, CEO, TeraSi
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About TeraSi
TeraSi is a deeptech startup based in Stockholm, Sweden which offers unique components and packaging for high-frequency wireless applications. Founded in 2020, TeraSi’s technology builds upon academic research at KTH Royal Institute of Technology and years of internal R&D. The company designs and manufactures all components from its Stockholm headquarters and now embarks upon a mission to scale their technology and bring it to mass markets.
Contact: James Campion, CEO, [email protected]