Tech News: TSMC Starts Small-Scale 2nm Wafer Production at Baoshan Facility

According to reports, 台积公司 is making significant strides in its 2nm wafer production, as it establishes two state-of-the-art 2nm fabrication facilities in Taiwan. These efforts are aimed at meeting the growing demand from major clients such as 苹果 , 高通 , and 联发科技 , with the company planning to ramp up to full production capacity over the next few years.

In a notable development, TSMC has already initiated small-scale production of 5000 wafers per month at its Baoshan facility, following a successful 60% yield rate in its 2nm trial production phase. This achievement marks a critical milestone in the company's journey towards large-scale production. Additionally, TSMC has unveiled a new version of its 2nm process, called N2P, which is an improved iteration of the first-generation 2nm technology.

The advanced N2P node?is expected to enter mass production by 2026, with TSMC forecasting a successful start to its first-generation 2nm product line in 2025. Reports from the Economic Daily indicate that TSMC has already begun limited production of its cutting-edge photolithography technology, though current output is restricted to 5000 wafers. However, earlier reports suggest that production during trial runs reached 10,000 wafers, with expectations that this figure could rise to 50,000 wafers by the end of this year. By 2026, the monthly wafer output is anticipated to hit 80,000, although it remains unclear whether this production will be based on the N2 or N2P process, or both.

As TSMC’s Baoshan and Kaohsiung facilities come online, the company's monthly wafer production is projected to increase rapidly, potentially reaching 40,000 wafers per month. With the anticipated wafer price hovering around $30,000, the rising cost of 2nm manufacturing is expected to be a significant factor. While these costs could discourage some customers due to the high prices, TSMC is actively working on strategies to reduce overall expenses. One such initiative is the CyberShuttle service, set to launch in April this year, which will allow companies like Apple, Qualcomm, and others to evaluate their chips on the same test wafers, thus lowering testing costs.

The future of TSMC’s 2nm production lies in achieving economies of scale through mass production. Once the Baoshan and Kaohsiung plants are operating at full capacity, the overall costs of wafer production should decrease, benefiting customers with more competitive pricing. However, to reach this point, both facilities must operate at 100% capacity to fully realize the potential of the 2nm node.

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