Tech News: Samsung Launches Industry's Thinnest LPDDR5X DRAM

On August 6, 三星电子 announced the mass production of the industry's thinnest 12nm-class Low Power Double Data Rate 5X Dynamic Random-Access Memory (LPDDR5X DRAM). This new memory chip features a packaging thickness of just 0.65 millimeters and supports capacities of 12GB and 16GB.

Utilizing advanced 12nm-class technology, the LPDDR5X DRAM incorporates a four-layer stacking structure and optimized processes for both the printed circuit board (PCB) and epoxy molding compound (EMC). Compared to the previous generation, the thickness of the new memory chip has been reduced by approximately 9%, while its heat resistance has improved by around 21.2%. Additionally, Samsung has achieved the industry's thinnest packaging thickness through an optimized back-lap process post-packaging.

The reduced thickness of the LPDDR5X packaging facilitates the development of thinner and lighter devices, enabling stable thermal management within the terminal. This minimizes the impact of heat on device performance, including speed and screen brightness. Beyond mobile devices, LPDDR applications have expanded to AI accelerators, computers, and various user data generation devices, making it an indispensable component of core memory.

Samsung plans to supply the 0.65mm LPDDR5X DRAM chips to mobile processor manufacturers and mobile device makers, further expanding the low-power DRAM market. The company is also committed to broadening its LPDDR5X product lineup, developing more compact packages such as six-layer 24GB and eight-layer 32GB modules.

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