Tech News: MediaTek Unveils Filogic 860/360 Wi-Fi 7 Connectivity Solutions

On November 23, 联发科技 has unveiled its latest wireless connectivity solutions, Filogic 860 and Filogic 360. As the Wi-Fi 7 market gains momentum, MediaTek continues its commitment to providing a diverse product portfolio to meet the growing demands of this burgeoning market.

Filogic 860 stands out as a chipset solution catering to a range of applications, including enterprise Access Points (APs), service providers, Ethernet gateways, Mesh nodes, as well as retail and IoT routers. Supporting dual-band Wi-Fi 7, with dual-band MLO speeds reaching up to 7.2Gbps, this platform is a technological marvel.

Key Features of Filogic 860 Include:

• Advanced high-efficiency 6nm process design
• Support for Single-MAC MLO
• 4096-QAM and MRU support
• Dual-band Wi-Fi 7, with dual-band MLO speeds up to 7.2Gbps
• Dual-band concurrent functionality: 2.4GHz 4T4R up to BW40; 5GHz 5T5R 4SS up to BW160
• Additional receive antenna supporting Zero-Wait DFS
• Filogic Xtra Range technology for expanded signal coverage

The Filogic 860 platform boasts a three-core Arm Cortex-A73 CPU with hardware acceleration, advanced network tunneling technology, and robust security features, meeting the diverse needs of enterprises and service providers alike.

Filogic 360 takes the form of a standalone single-chip product, integrating Wi-Fi 7 2x2 MIMO and dual Bluetooth 5.4. Designed for edge terminal devices, streaming equipment, and a wide array of consumer electronics, Filogic 360 delivers a high-speed Wi-Fi 7 experience for devices such as smartphones, PCs, set-top boxes, and OTT streaming platforms.

Key Features of Filogic 360 Include:

• Optional three-frequency Wi-Fi 7 2x2 MIMO, up to a maximum of 2.9Gbps
• 4096-QAM and MRU support
• 160MHz bandwidth support
• Filogic Xtra Range with a unique Hybrid MLO solution for extended communication range
• Bluetooth 5.4 dual support, enhancing applications such as gaming
• Integrated DSP supporting LC3 codec and Bluetooth LE Audio
• MediaTek Wi-Fi Bluetooth Coexistence technology for a seamless connectivity experience

Both the Filogic 860 and Filogic 360 wireless chip solutions are anticipated to undergo large-scale production by mid-2024.

?

Stay tuned for updates: ?? https://www.smbom.com/ ??

If you like this article, please give us?a like! ?? ??