Simple BGA Reballing Steps.
Krishna keshri
![Krishna keshri]()
Krishna keshri
Profound understanding of machine troubleshooting and process optimization (SMT, THT, PCBA Assembly)
Step 1: Deball the Device:- Apply paste flux using a syringe and spread with a gloved finger on the balls of the device. Using the proper blade tip and or temperature setting based on the alloy of the solder balls, remove solder balls. Use solder wick to remove remnant solder making sure pads are flat.Make sure to move the braid up and down not sweeping the base of the part which may scratch the mask or lift pads on the part.
Step 2: Clean the Deballed Part:- Using properly IPA and non static wipes clean off the flux residue from the bottom of the deballed part.
Step 3: Apply Paste Flux:-Apply paste flux to the bottom of the part. Spread with a soft brush until uniform thickness is on the bottom of the part.
Step 4: Put Preform Ball Side Up:- Place preform ball side up onto flat heat resistant surface. Make sure the preform lines up to the patterns on the device. Make sur
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you are attached the proper solder alloy solder balls on to the device.
Step 5: Carefully Place Device on Top of Preform:- Carefully place the device on top of the BGA reballing preform make sure the pattern orientation is correct.
Step 6: Square Up Preform to Device:- Using angle brackets or other meas "square up" the preform to the BGA.
Step 7: Reflow:- Place "sandwich" construction of the preform and device in to reflow oven. Make sure the proper temperature setting.
Step 8: Remove Preform:-While still slightly warm remove the preform from the device. Inspect to make sure all of the balls have transferred to the device.
Step 9: Inspect the Reballed Device:-Inspect the reballed device under magnification to the standards you have in mind.