SiC Power Devices, GaN HeMTs and More

Package Innovations for SiC Power Devices

Packaging of semiconductor power devices presents several challenges. In this article, we will showcase package innovations for?SiC power devices.

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• GaN HEMT Devices: History and Evolution From Eudyna to Major Manufacturers
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• The Essentials of AC/DC Power Supplies

Panel Discussion: Prospects and Challenges of SIC and GaN in Multiple Application Contexts

This panel discussion from #Electronica2022 discusses the benefits and challenges for SiC and GaN widespread adoption.

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