Share Board Tool & WLCSP

Welcome to our latest newsletter! In this edition, we're excited to introduce the new "Share Board" tool on FlashPCB, making it easier than ever to collaborate on PCB designs. Plus, meet our newest team member, Jessica Grant, and dive into the latest advancements in WLCSP technology from our ongoing blog series.

Share Board Tool

With the new "Share Board" tool on FlashPCB, sharing a quote with a client or your purchasing office is now super easy. The Share Board tool allows you to share your finished board and BOM with a second user, who can then adjust the quantity of boards, lead time, and shipping method before placing an order. Check out our step-by-step guide in this blog post .

Jessica Joins FlashPCB Team

As part of our National Science Foundation SBIR Phase 2 award, we have expanded our team by bringing on Jessica Grant full-time as a software engineer. She officially started last Monday. Prior to joining FlashPCB, Jessica was a software engineer at CS Engineering and Docketeer. Jessica is an alumna of the London School of Economics and Colgate University. Feel free to connect with her on LinkedIn .

Wafer Level Chip Scale Packaging

Part four of our blog series on IC packages is up! In this post, we analyzed 271 unique WLCSP packages with lead counts ranging from 4 to 210. We also discuss the transition from ball grid array with a 0.4mm pitch to the hex-packed bumps with a 0.3mm pitch for WLCSP packages. We will conclude the series with two more posts. The first will share all the data we collected and discuss our data collection methodology. The final post will offer a forward-looking examination of where we see the industry heading in the next five to ten years.

Labor Day Holiday

FlashPCB will be closed on September 2nd for Labor Day. Additionally, August 29th and 30th will not be included in lead times due to staff holidays. To check when your PCB will ship, please visit our Capabilities page .