Semiconductor technologies evolving to meet generative AI demand - July 2024
Power and processor-hungry AI set to drive next stage of chip development – Generative artificial intelligence (AI) is redefining the value of work, and its exponential need for performance is driving demand for power consumption and processing capacity in ways that it is not yet clear how this will be met.
Tools based on generative AI have moved beyond niche technical applications to consumer use, changing the way images, video, music, and other content are produced. The impact is expected to reach almost every professional role, including lawyers, architects, doctors and more.
The AI server market is expected to expand at a compound annual growth rate of 36% from 2023 to 2029, outpacing overall data center growth.
Jerome Azemar , Sales Force Effectiveness Director at Yole Group, recently attended the International Semiconductor Executive Summit (ISES) Taiwan and among the key themes that emerged are the evolution in semiconductor technologies to meet demand.
HOW WILL HBM4 EVOLVE?
Generative AI and high-performance computing (HPC) are fueling growth in data center dynamic random-access memory (DRAM) demand.
Yole Group predicts that high-bandwidth memory (HBM) bit shipments will rise by around 48% between 2023 and 2029, with HBM’s share of the DRAM market rising above 6% from around 2% in 2023.
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