Semiconductor Manufacturing Equipment Market Size is Estimated to grow at a CAGR of 9.9% during the forecast period

Semiconductor Manufacturing Equipment Market Size is Estimated to grow at a CAGR of 9.9% during the forecast period

  • The semiconductor manufacturing equipment market is expected to grow at a compound annual growth rate (CAGR) of 9.9% over the forecast period of 2024–2031, from a valuation of approximately USD 103.1 billion in 2023 to USD 237 billion in 2031.
  • Technology advancements and the operation of current devices depend on semiconductor production equipment. The market is increasing and sustainable because it is in line with many different industries.
  • The apparatus and tools used in the fabrication of semiconductor devices, such as integrated circuits and microchips, are referred to as semiconductor manufacturing equipment.

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GROWTH DRIVERS

  • The need for cutting-edge semiconductor manufacturing equipment is driven by the ongoing breakthroughs in semiconductor technology, such as the creation of smaller and more powerful chips, which call for cutting-edge machinery.
  • The market for semiconductors is driven by several factors, one of which is the rise in demand for consumer electronics such as tablets, smartphones, laptops, and other smart appliances.
  • According to Statista, the consumer electronics market is anticipated to reach USD 269.2 billion by 2024 and USD 397 billion by 2029 with 2.6 billion consumers.
  • The demand for specialized semiconductor manufacturing equipment is being driven by the expansion of the Internet of Things across multiple industries, such as manufacturing, healthcare, and automotive. IoT Analytics projects that there will be 29 billion IoT connections by 2027.

MARKET SEGMENTATION:

·?????????By Type–?Lithography (DUV and EUV), Water Surface Conditioning (Etching and Chemical Mechanical Planarization), Wafer Cleaning Equipment (single-wafer spray system, single-wafer cryogenic system, batch immersion cleaning system, batch spray cleaning system and scrubber), deposition equipment (PVD, CVD and others), back-end equipment (assembly and packaging, dicing, metrology, bonding, water testing/IC testing)

·?????????By Product Type –?Memory, Foundry, Logic, MPU, Discrete, Analog, MEMs and others

·?????????By Dimension-?2D,2.5D and 3D

·?????????By Application-?Semiconductor fabrication plant/foundry, semi electronics manufacturing and test home

·?????????By Supply Chain participant-?IDM firms, OSAT companies and foundries

·?????????By Region-?North America, Europe, Asia Pacific, The Middle East and Africa, South America

Global Key Players:

·?????????Tokyo Electron Limited

·?????????ASMLHolding N.V.

·?????????Applied Materials, Inc.

·?????????Teradyne, Inc.

·?????????ASM International N.V.

·?????????Hitachi High-Technologies Corporation

·?????????LAM Research Corporation

·?????????SCREEN Holdings Co., Ltd

·?????????KLA Corporation

·?????????Plasma-Therm, LLC

·?????????Advantest Corporation

·?????????Semiconductor Equipment Corporation

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