Semiconductor Manufacturing: end-to-end quality manufacturing services

The semiconductor industry has gradually evolved into a highly specialized field where quality and expertise are non-negotiable factors. Off-the-shelf chips are increasingly being replaced by more targeted and efficient custom solutions that can more easily meet the criteria demanded by modern products. As a result, Application-Specific Integrated Circuits (ASICs) are now in much higher demand, and as this demand grows, so does the need for advanced manufacturing services capable of turning complex designs with ever-shrinking nodes into market-ready components.

To bridge the gap between design and mass production, businesses need a semiconductor partner that not only understands their design requirements, but is able to see that design brought to life in a way that reflects the final vision of their product. Those that run with complex designs with advanced nodes - from 130nm to even 5nm FinFET and beyond – need to ensure their projects are well managed and optimized to avoid costly setbacks. EnSilica has well-established supply chain partnerships with some of the world’s largest semiconductor suppliers, including TSMC, GlobalFoundries, ASE, and others, allowing it to oversee both the technical and logistical aspects of semiconductor production, ensuring that sophisticated ASIC designs are not just functional in simulation but are manufactured into high-quality products ready for the market.

?Broad foundry access and tapeout support

The journey from tapeout to mass production is a critical phase in ASIC development, where the transition from design to physical silicon occurs. At the tapeout stage, all design elements are finalized and prepared for fabrication, marking the culmination of several months or even years of intricate design and functional verification work. However, as readers will be aware, reaching this milestone is only the beginning; any error at this stage can lead to costly silicon re-spins and long delays. EnSilica can help ensure that designs are correctly verified before tapeout, reducing the likelihood of errors downstream.

Design is crucial, but it’s equally important to ensure that the design is ready for production with testing and packaging some of the key considerations. EnSilica’s tapeout process involves a tailored setup for each technology node, using the leading industry-standard EDA tools to ensure that designs comply with foundry-specific rules for smooth and successful project execution. Close collaboration with foundries ensures quality control throughout the entire manufacturing cycle.

?Qualification and Production test development

Qualification and production test development is a core aspect of EnSilica’s manufacturing services, designed to ensure that high-volume semiconductor products meet the most rigorous quality and reliability standards. We know that every customer has specific requirements for product qualification, such as industry standards like AEC-Q100 for automotive-grade components. EnSilica develops customized test software tailored to maximize the efficiency of both wafer and packaged device testing, ensuring flawless operation across a full temperature spectrum, guaranteeing that each product meets – or even exceeds – required specifications before it reaches the market.

End-of-line services are equally important. These services encompass visual inspections to identify any defects, tape-and-reel services, and moisture barrier bag (dry-pack) packaging to protect products during shipment. EnSilica’s access to a range of test platforms, such as Advantest v93k, Teradyne Ultraflex, and ETS-88, covers all manner of devices, from RF and complex digital components to simpler, cost-driven analog and power devices. This holistic approach to testing guarantees that products are delivered safely, efficiently, and in full compliance with the highest quality standards.

Packaging design and manufacture

Design and rigorous testing won’t matter if the integrity of the chip cannot be preserved in terms of reliable connections and thermal performance – both of which are crucial when it comes to the long-term reliability and function of the component. EnSilica’s process begins with an in-depth understanding of the customer’s requirements, taking into account factors such as application environment, size constraints, lead pitch, electrical and thermal performance needs, industry standards, and cost considerations.

Once these requirements are fully understood, the most suitable packaging type can be determined. Whether the solution involves leaded or leadless, flip chip or wire bond, lead frame or substrate-based, or wafer-level chip scale packaging (WLCSP), the selection should be driven by the unique application needs of each project. EnSilica thoroughly vets this process through detailed package design checklists and supplier design feasibility studies, before choosing the right package assembly partner for implementation.

Die and wafer banking

Stocking and wafer banking provide critical resilience in semiconductor manufacturing by allowing a manufacturing partner to hold buffer stock of finished goods or raw materials, such as wafers or dies, either within their own supply chain or through a specialist distribution partner. This approach helps mitigate supply chain disruptions, such as temporary manufacturing halts due to external factors, by ensuring that production can continue without significant delays. Holding wafer or die stock is often more cost-effective than storing finished products, offering both flexibility and cost savings.

Partnering with EnSilica

Long-term support from manufacturing partners is vital to ensure that your ASIC is reliably supplied over the full product life-time. That’s why EnSilica’s services extend beyond production, with continuous yield monitoring, troubleshooting, reliability testing, and end-to-end tapeout support to help customers maintain a competitive edge in the market.

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Click here to read more about EnSilica’s Manufacturing Services capabilities

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