Semiconductor Engineering's Test, Measurement & Analytics Newsletter for June 2021
Top Stories
Reliability Costs Becoming Harder To Track
Test, metrology and inspection costs blur as the number of options increase and chips are developed for specific applications.
Is There A Practical Test For Rowhammer Vulnerability?
New approaches surface for a persistent DRAM issue.
Digging Much Deeper With Unit Retest
It’s no longer just an automatic retest to improve yield. Rising product complexity, pressures on manufacturing costs, and better data are making this process more nuanced.
Blogs
Editor in Chief Ed Sperling examines the impact of new technologies, in 3 Technologies That Will Change Test.
Onto Innovation’s Anoop Somanchi illustrates the role of Fourier transform infrared spectroscopy (FTIR) in monitoring BPSG films in mold layers, in Expanded Material Metrology For Refined Etch Selectivities.
Synopsys’ Pawini Mahajan and Raja Koneru explain how to find issues earlier by validating the connection of clocks and resets, in Signal Connectivity Checks Are Not Just For Design-For-Test Teams.
Advantest’s Koji Miyauchi dissects a test tool that combines conventional ATE and system-level test for OTA test of Bluetooth Low Energy devices, in Hybrid System-Level Test For RF SiP.
Sponsor White Papers
The Emergence Of Inline Screening For High Volume Manufacturing
The results of KLA’s proof-of-concept studies for I-PAT using a prototype engineering system.
Characterization Of CMP Processes With White Light Interferometry
Measurement and analysis advantages of white light interferometry for CMP components.
In-Field, In-Mission Reliability Monitoring Based On Deep Data
A Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure.
The Next Generation Of Testbench Debug Productivity
Debug is inherently a challenging process, but this white paper will describe several factors that have made it more complex in recent years.