Semi-Automatic Die Bonder with Motorized Bond Axis
Die Bonder adds a motorized, programmable Z-axis to the repertoire of the universal bonder, making it extra useful for repetitive processes in small-scale production, where operator influence must be minimized. The bonder really shines in applications with highest precision requirements, such as flip-chip or laser diode placement. The bonder is equipped with electronic die ejector system for pick-up from wafer. An optional high-resolution beam splitter unit allows sub-micron placement accuracy.
Applications: -??????????????
???????????? Die sorting from wafer into waffle packs or gel packs
???????????? Die attach with adhesive (stamped or dispensed)
???????????? 3D packaging of MEMS, MOEMS, VCSEL, Photonics, ...
???????????? High-precision placement with visual adjustment by beam-splitter unit for look-up inspection of edges, corners or patterns, e.g., for laser bars
???????????? Flip-Chip with ultrasonic die attach
???????????? Flip-Chip with adhesives or anisotropic foils
???????????? Pre-Sinter bonding
???????????? Sensor assembly
???????????? UV curing of die attach
???????????? Eutectic bonding of AuSi, Copper Pillar and others
???????????? Ultrasonic bonding on a curved surface
Features: -
? Stereo-microscope with optional camera, T-Suite Software to switch automatically between cameras
? Pick/Place Z-Axis with force sensor and Active Bond Force Control
? Motorized Z-spindle drive for programmed or quick manual moves with 120 mm travel and True Vertical Technology?. Mini-keypad for up/ down motion to defined positions. Manual tool rotation 360° with 3:1 and 18:1 stepdown gear
? XY-table with parallel linear guides and active arrest for rapid and exact manual positioning with release/clamp button; micrometer screws for precise adjustment in X and Y
? XY linear encoders for precise position measurement
? High-resolution placement unit with beam splitter and high-resolution camera, LED lighting for upward / downward and Coax looking or superimposed inspection, for ultra-precise Multi Point Alignment (range 50x50mm) at sub-micron resolution. Additional alignment features such as edge detection for top Chip alignment
? Substrate holders, heat able up to 450°C with internal, high-speed temperature controllers, optional versions with tool heating and flooding with cold or heated forming gas.
? Scrubbing motion or Ultrasonic bonding action
? Stamping unit for adhesive application by specialized stamping tools
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? Stamping unit for adhesive application by specialized stamping tools
For personalized support, reach out to our expert:
Mr. Rajendra kumar Singh (DGM)
?? Call: +91 9717004203
?? Email: [email protected]
https://www.higgsbosonsystems.com
Your success starts with the right advice—connect with us today!
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