Scrub Mark
Dinesh Kumar Sharma
Dinesh Kumar Sharma
Technologist l Wafer Testing l Probe Card l Load Board HW Design l Wafer/Pkg Testing l Wafer Package Test Cost Optimization
Poor planarization will result in uneven contact pressure and accelerated probe tip wear on the lower probes. Although larger pad geometries provide plenty of room for scrub, poor planarization results in excessive overdrive, which leads to longer scrub marks, premature probe wear, overstressed and damaged probe needles, and probes that scrub off the pad.