Samsung Completes HBM4 Logic Chip Design, Employs In-House 4nm Process

According to a report by the Chosun Ilbo, Samsung's Device Solutions (DS) Division recently completed the design of a high-bandwidth memory 4 (HBM4) logic chip. The company's Foundry Division has commenced trial production using its 4nm process, marking a significant milestone in Samsung's efforts to regain leadership in the HBM market. The final performance validation of the logic chip will pave the way for HBM4 sample testing.

HBM4 Logic Chip: The Brain of High-Bandwidth Memory

Often referred to as the "brain" of the HBM stack, the logic chip (also known as the base die) controls the multiple layers of DRAM stacked above it. In the HBM4 generation, the doubling of I/O pin counts and integration of additional functionalities make the logic chip's performance and efficiency critical.

Given the technical challenges, the top three global DRAM manufacturers have opted to outsource logic chip production to advanced semiconductor foundries. However, Samsung's decision to leverage its in-house 4nm process for this critical component underlines its commitment to vertically integrated innovation.

Addressing the Heat Challenge

Heat dissipation remains one of the greatest challenges for HBM, with logic chips contributing the most to overall heat generation. Adopting advanced process nodes, such as Samsung's 4nm, helps to improve energy efficiency and performance. These advancements are particularly crucial for HBM4, which features higher memory density and faster data throughput.

In addition to its 4nm logic chip design, Samsung is introducing 10nm-class 1c DRAM technology for HBM4 production, enabling 16-layer stacking through innovative techniques like bump-free hybrid bonding.

Samsung's Strategic Shift in HBM Market

Samsung's aggressive push with HBM4 reflects its strategy to reclaim market share lost in the HBM3E generation to competitors like SK hynix. By employing advanced internal processes and cutting-edge DRAM technologies, Samsung aims to deliver a competitive and energy-efficient HBM4 solution.

Outlook for HBM4

HBM4 is set to play a pivotal role in applications such as artificial intelligence (AI), high-performance computing (HPC), and data centers, where the demand for memory bandwidth and efficiency continues to soar. Samsung's innovations in HBM4 are expected to enhance the company's position in these critical markets.