SAC305 Interconnects at LTS Temperatures Using Supercooling-By Ian Tevis, Ph.D., CTO and President, SAFI-Tech
BGA assembly with supercooled SAC-based microcapsules.

SAC305 Interconnects at LTS Temperatures Using Supercooling-By Ian Tevis, Ph.D., CTO and President, SAFI-Tech

Demand for low temperature processing of known and trusted materials is a driving force for innovation in solder metal technology. The supercooled liquid state represents one of these innovations, and is an opportunity for the process temperature of the metal to be decoupled from the melting temperature of the metal.

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