Rolling out new LCP air-cavity package technology for Photonic Integrated Circuits (PICs)

On July 17th 2024 Laser Focus World published a paper on the ongoing collaboration between Koelink Consultancy, the Chip Integration Technology Center (CITC) and?RJR Technologies (RJR Technologies, Inc.) to develop a Low-Cost, Air-Cavity Package for?Photonics Integrated Circuits (PICs).

The paper can be found here.

This underlines the ongoing effort to bring this technology to the market as a viable high-volume low-cost alternative to existing metal butterfly packages, TO-cans or TOSA/ROSA packages. RJR is ready to accept the first orders for small packages series for qualification, testing or prototyping. This package is a large area package (roughly 45x30x9 mm), NiPaAu plated leads and leadframe and a AuNi plated thermal base. The large package should facilitate a large number of potential applications to prove the reliability and suitability of this package concept. The technology in general is wel suited to offer a large variety of solutions, some with surprising small NRE and time to market (eg different lead frame configurations can easily be included provided some overall dimensions are adhered and packages can also be provided with 2 optical I/Os on either the same or opposite sides). This offers ample opportunity to create a dedicated package solutions for any application. See figure 1 and figure 2 for the eared and earless version of this available package.

There are ongoing discussion on other package layouts, such as ROSA/TOSA, TO-can or a smaller 14 pins butterfly package (see figure 3).

There is an opportunity to meet me at the PIC Summit Event in October 15-15 in Eindhoven the Netherlands to discuss this technology and various customization options in much detail. If you like to meet me, have questions or would like to receive some demo samples yourself, please contact me:

Marco Koelink