RO4003C LoPro PCB Rogers 12.7mil Reverse Treated Foil (RTF) Circuit Board for High Speed Back Planes
RO4003C LoPro laminates leverage an exclusive technology developed by Rogers, enabling the bonding of reverse treated foil to the standard RO4003C dielectric. This unique approach creates a laminate with minimal conductor loss, leading to improved insertion loss and enhanced signal integrity. Remarkably, this achievement is accomplished while preserving all the other desirable characteristics of the standard RO4003C laminate system. With RO4003C LoPro laminates, engineers can achieve superior performance without compromising on the well-established benefits of the RO4003C material.
Features and Benefits:
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1.?Lower insertion loss
2.?Low PIM
3.?Increased signal integrity
4. High circuit density
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Low Z-axis coefficient of thermal expansion
1.?Multi-layer board capability
2. Design flexibility
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Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns
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CAF resistant
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Some Typical Applications:
1. Digital applications such as servers, routers, and high speed back planes
2. Cellular base station antennas and power amplifiers
3. LNB’s for direct broadcast satellites
RF Identification Tags