RO4003C High Frequency PCB

RO4003C High Frequency PCB

Hello everyone,

Welcome back to our channel.

Today, we’re going to introduce high frequency PCB built on RO4003C laminates.

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RO4003C?high frequency materials are?woven glass reinforced hydrocarbon ceramic-filled laminates produced by?Rogers Corporation. It?has?the?similar electrical properties of?PTFE/woven glass?and manufacturability of epoxy resin materials.

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RO4003C materials?are designed to offer superior high frequency performance, with dielectric constant of 3.38 +/- 0.05, dissipation factor of 0.0027 at 10 GHz.

Low loss results in excellent electrical performance and allows applications with high operating frequencies.

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RO4003C material possesses the?stable electrical?properties needed by designers of RF microwave circuits, matching networks and controlled impedance transmission lines.

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The coefficient of thermal expansion (CTE) of RO4003C?material (11 and 14 ppm/°C?on X and Y axis) is similar to that of copper?(17 ppm/°C)?which allows the material to exhibit excellent dimensional stability, a property that needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of 46 ppm/°C provides reliable plated through-hole quality, even in severe thermal shock applications.

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Unlike soft PTFE base high performance materials, RO4003C?substrate is a rigid, thermoset laminate that can be fabricated using standard FR-4 processes, do not require specialized via preparation processes. This properties allow it?to?be used?in volume manufacturing and get competitively priced.

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For RO4003C?PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types. RO4003C?PCBs have wide thickness. These?are the standard thickness such as 8?mils, 12?mils, 20 mils?and 32 mils etc.


Finished copper on PCB is 1oz, 2oz?and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.


Solder mask of green, black, red and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, bare copper etc. for pads plating.

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Now on the screen is a type of 20mils RO4003C PCB with immersion gold for antennas. We can also see its applications in base station antennas, power amplifiers, RF?identification tags, automotive radar and sensors etc.

Multi-layer circuit boards on RO4003C are manufactured by combining several cores through bondply RO4450F. In order to save production cost but not reduce signal loss in high frequency environment,the construction of high frequency materials mixed with FR-4 came into being.At present, the manufacturing technology of hybrid?circuit board is mature and they are welcomed?in the market.?

OK. This concludes Episode 9. Thank you for your watching.?See you next time.

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