The Rise of Panel-Level Packaging: High Throughput, Unrivaled Precision and Speed
Nordson Electronics Solutions
Our surface prep, coating, dispensing, and selective soldering solutions make reliable electronics an everyday reality.
Hi everyone. How are you?
I'm doing great. This month, we're talking about panel-level packaging. As mentioned in our last newsletter, we were privileged to share details about our panel-level packaging solution at SEMICON West in San Francisco in July. What a fantastic show! Up next, we're hosting a booth at SEMICON Taiwan, September 4-6, at TaiNEX 1&2 in Taipei, where you'll have the opportunity to meet with us and explore several of our solutions, including panel-level packaging.
SEMICON Taiwan and Heterogeneous Integration Global Summit 2024
Likely, you're already familiar with the concept of panel-level packaging. The industry has discussed and explored using large panels since about 2016. However, with the slowing of Moore's Law, the subsequent renaissance in advanced packaging, and the increased demand for chips, interest in panel-level solutions is reigniting. Chiplets and heterogeneous integration, anyone? High-end computing, AI applications, software-defined vehicles, Medtech? As an essential innovation, panel-level packaging has incredible potential to support the next generation of advanced packaging, making greater efficiency and cost reduction a reality. So, if you have a high-volume application that demands high-yield, panel-level packaging could be for you! And now is the time!
Warpage has always been a challenge in wafer and panel applications, but warpage effects can be more pronounced in large panels. Nordson engineers have developed a panel-level packaging solution that allows large panels to be handled and transported to and from the precision fluid dispensing process, even when warped. Once in the fluid dispensing system, our solution successfully manages the warpage to ensure precise dispense results.
We love seeing you at shows, but know not everyone can attend. That's why I'm sharing our wafer and panel-level brochure with you here (I'm so glad you subscribe to this newsletter. Please share it with your friends or colleagues who can benefit from it :)). The brochure is packed with details about how we're advancing panel-level packaging (and, bonus, how we've integrated wafer-level applications into the fab) to help you lower packaging costs and increase throughput and yield. Whether you're a process engineer or on the equipment maintenance, operations, or factory automation team, this brochure has something for you.
Ready to learn more?
As always, thanks for reading this far.
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Sending positive and productive vibes your way!
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Talk to you next month.
To infinity and beyond,
Tonya Stefan
Senior Content Marketing Strategist
Nordson Electronics Solutions