RF-35A2 PCB 2-layer 5mil with Immersion Silver for Power Amplifier

RF-35A2: Unleashing the Power of Ultra-Low Loss Power Amplifier Substrate for Optimal Performance

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Introduction: Introducing RF-35A2, a groundbreaking innovation in PCB manufacturing that unleashes the full potential of ultra-low loss power amplifier substrate. Engineered with meticulous attention to detail, RF-35A2 sets new benchmarks in insertion loss properties, maintaining a consistent dielectric constant across the laminate. Its advanced ceramic dispersion ensures minimal coefficients of thermal expansion, making it an ideal choice for surface mounting chip carriers. In this article, we delve into the remarkable features and benefits of RF-35A2, shedding light on its diverse applications across industries.

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Features:

RF-35A2 boasts an impressive array of features that contribute to its unparalleled performance:

• Unleashing Ultra-Low Loss Power Amplifier Substrate: RF-35A2 elevates power amplifier performance to unprecedented levels with its ultra-low loss properties.
• Consistent Dielectric Constant (Dk): RF-35A2 maintains a reliable and unwavering dielectric constant of 3.5 at 10 GHz, ensuring consistent signal transmission.
• Minimal Dissipation Factor: With a dissipation factor of a mere 0.0015 at 10 GHz/23°C, RF-35A2 facilitates maximum power transfer while generating minimal heat.
• Exquisite Thermal Expansion Coefficients: RF-35A2 showcases impressively low coefficients of thermal expansion, measuring at 10 ppm/°C for x, 13 ppm/°C for y, and 108 ppm/°C for z, ensuring exceptional stability.
• Superior Peel Strength: The laminate exhibits outstanding copper peel adhesion, guaranteeing robust and secure bonding.
• Negligible Moisture Absorption: RF-35A2's moisture absorption rate is a mere 0.03%, amplifying its stability and performance in various environmental conditions.
• Enhanced Drilling Ease: RF-35A2 simplifies and streamlines drilling processes, allowing for precise and effortless PCB assembly.

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Benefits: Leveraging RF-35A2 as a substrate offers numerous advantages for PCB manufacturers and designers:

• Unparalleled Low Loss Properties: RF-35A2's ultra-low loss characteristics unlock high-performance applications that demand minimal signal attenuation.
• Consistent Dielectric Constant: With a uniform dielectric constant throughout the laminate, RF-35A2 ensures predictable and reliable electrical performance that meets stringent requirements.
• Superior Peel Strength: The laminate's exceptional copper peel adhesion guarantees robust connections, reinforcing overall reliability and durability.
• Enhanced Moisture Resistance: RF-35A2's low moisture absorption rate fortifies its long-term stability and performance, even in humid environments.
• Precise Dk Control: RF-35A2 offers a Dk tolerance of ± 0.05, providing precise control over electrical properties and enabling adherence to design specifications with meticulous accuracy.

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PCB Stackup and Construction Details: For a 2-layer rigid PCB utilizing RF-35A2, the stackup and construction details are as follows:

• Copper Layer 1: 35 μm thickness.
• RF-35A2: 0.127 mm (5 mil) thickness.
• Copper Layer 2: 35 μm thickness.
• The finished board has a total thickness of 0.25 mm, with the outer layers coated with 1 oz (1.4 mils) of finished copper weight. The PCB dimensions measure 76.04 mm x 33.18 mm, with a minimum trace/space requirement of 5/5 mils. Each board undergoes a meticulous 100% electrical test prior to shipment, ensuring uncompromising quality.

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Applications: RF-35A2 finds a wide range of applications across industries where high-performance and dependable PCBs are essential. Some typical applications include:

• Power Amplifiers: RF-35A2's ultra-low loss properties make it the perfect choice for power amplifier circuits, facilitating efficient signal amplification.
• Filters/Couplers: The material's consistent dielectric constant and low loss characteristics enable precise filtering and coupling applications, ensuring optimal performance.
• High-Speed Digital: RF-35A2 facilitates high-speed digital signal transmission with minimal signal degradation, catering to the demands of high-frequency applications.
• Passive Components: The laminate supports the construction of reliable and stable passive components, elevating their performance and longevity.
• Wireless Antennas: RF-35A2 provides an excellent substrate for wireless antenna development, offering low loss and consistent signal propagation for enhanced connectivity.

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Conclusion:

RF-35A2 has revolutionized PCB manufacturing with its ultra-low loss power amplifier substrate. With exceptional dielectric properties, superior copper peel adhesion, and outstanding moisture resistance, RF-35A2 ensures optimal performance and unwavering reliability. Its versatility is evident in applications ranging from power amplifiers to high-speed digital circuits. By incorporating RF-35A2, manufacturers and designers can achieve high-performance solutions that meet the demands of modern technologies. With global availability and adherence to IPC-Class-2 standards, RF-35A2 stands as a game-changing substrate in the pursuit of efficient and reliable PCB manufacturing.

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About us

Based in China, Bicheng PCB adheres to the philosophy of helping small and medium sized companies reduce their cost and time spent on PCB. We provide a variety of PCB products to meet the demands.

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Our Driving Circuit Boards Capabilities 2019

Blind vias, Buried vias

Flex PCB

Heavy Copper Boards 12oz

High Tg, High CTI Material

Hybrid FR-4 and High Frequency Material

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Multilayer PCBs to 32+ copper layers boards

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Our Services

Focus on Prototypes, Small Batches, Volume Production

Quick turn-around, double sided PCB 24 hours available.

Door to door shipment service

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